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1. CN1216933 - Method and apparatus for recirculating a heavier solution from the separation part of two separable solutions into a mixing unit

Office Chine
Numéro de la demande 97194294.3
Date de la demande 29.04.1997
Numéro de publication 1216933
Date de publication 19.05.1999
Numéro de délivrance 1090515
Date de délivrance 11.09.2002
Type de publication C
CIB
C22B 3/02
CCHIMIE; MÉTALLURGIE
22MÉTALLURGIE; ALLIAGES FERREUX OU NON FERREUX; TRAITEMENT DES ALLIAGES OU DES MÉTAUX NON FERREUX
BPRODUCTION OU AFFINAGE DES MÉTAUX; TRAITEMENT PRÉLIMINAIRE DES MATIÈRES PREMIÈRES
3Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés
02Appareillage à cet effet
B01D 11/04
BTECHNIQUES INDUSTRIELLES; TRANSPORTS
01PROCÉDÉS OU APPAREILS PHYSIQUES OU CHIMIQUES EN GÉNÉRAL
DSÉPARATION
11Extraction par solvants
04de solutions
//C22B15:00
CPC
C08K 5/13
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
04Oxygen-containing compounds
13Phenols; Phenolates
C08K 5/3435
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
16Nitrogen-containing compounds
34Heterocyclic compounds having nitrogen in the ring
3412having one nitrogen atom in the ring
3432Six-membered rings
3435Piperidines
H01L 23/293
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
29characterised by the material ; , e.g. carbon
293Organic, e.g. plastic
H01L 24/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
H01L 33/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
56Materials, e.g. epoxy or silicone resin
H01L 2224/05599
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
0554External layer
05599Material
Déposants Outokumpu Technology Oy
奥托昆普技术公司
Inventeurs Bror Nyman
布鲁尔·内曼
Launo Lilja
洛诺·莉利亚
Stig-Erik Hultholm
斯提格·E·霍尔托尔姆
尤哈尼·吕拉
拉伊莫·库西斯托
彼德里·泰帕莱
提莫·萨伦帕
Mandataires he tengyun
中国国际贸易促进委员会专利商标事务所
Données relatives à la priorité 961831 30.04.1996 FI
Titre
(EN) Method and apparatus for recirculating a heavier solution from the separation part of two separable solutions into a mixing unit
(ZH) 分离部中重溶液再循环入混合单元的方法和设备
Abrégé
(EN)
The invention relates to a method for recirculating the heavier solution from the separation part of liquid-liquid extraction to the mixing unit of the same extraction step, so that part of the recirculated solution is returned to the mixing unit from the overflow of the discharge end of the separation part. An essential feature of the invention is that the major part of the heavier solution recirculated into the mixing unit is obtained from the separation part proper, along the whole width thereof. The invention also relates to an apparatus based on said method, in which apparatus, in the bottom part of the settler (6) there is located a heavier solution collecting channel (13) extending over the whole width of the settler and being provided with suction pipes (15) which are oriented in an inclined fashion towards the solution to be collected from the channel.

(ZH)

本发明涉及一种再循环方法,用于使来自萃取步骤的分离部的较重溶液再循环进入同一步骤的混合单元,从而使循环溶液的一部分由分离部的排出端的沉淀溶液的溢流返回混合单元。本发明的主要特点是再循环进入混合单元的较重溶液的大部分是沿着分离部整个宽度取自分离部本身。本发明还涉及一种以上述方法为基础的设备,在该设备中,在沉降槽(6)的底部有一个较重溶液集液管(13)沿着沉降槽的整个宽度延伸并且具有多个从绝缘漆斜着朝向待收集溶液的吸液管(15)。

Également publié en tant que
MXPA/a/1998/008991
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