(EN) An electrode formed by molding a semiconductor device with resin. The electrode comprises: a first resin mold portion formed on a front surface of the semiconductor device and having a first thickness(t1); a second resin mold portion formed on a back surface of the semiconductor device and having a second thickness (t2) greater than the first thickness; and an exposed portion formed in a part ofthe first resin mold portion corresponding to an end of the semiconductor device.
(ZH) 一种电极,其是通过对半导体器件进行树脂模塑而形成的。电极具有:第一树脂模塑部,其形成于半导体器件的正面,具有第一厚度(t1);第二树脂模塑部,其形成于半导体器件的背面,具有比第一厚度大的第二厚度(t2);和露出部,其形成于第一树脂模塑部的与半导体器件的端部对应的部分。