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1. CN208111445 - Novel high pixel image sensor

Office
Chine
Numéro de la demande 201820581700.8
Date de la demande 23.04.2018
Numéro de publication 208111445
Date de publication 16.11.2018
Type de publication U
CIB
H01L 27/146
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
27Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun
14comprenant des composants semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement en énergie électrique, soit comme dispositifs de commande de l'énergie électrique par ledit rayonnement
144Dispositifs commandés par rayonnement
146Structures de capteurs d'images
CPC
H01L 27/146
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
H04N 5/225
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
Déposants DONGGUAN WANGFU ELECTRONICS CO., LTD.
东莞旺福电子有限公司
Inventeurs XIAO WENXIONG
萧文雄
CHEN JINHUA
陈进华
MO LINXI
莫林喜
Mandataires 东莞市说文知识产权代理事务所(普通合伙) 44330
Titre
(EN) Novel high pixel image sensor
(ZH) 一种新型高像素影像传感器
Abrégé
(EN) The utility model relates to a novel high pixel image sensor, including camera lens, motor, glass optical filter, isolation seat, image sensor, base plate and FPC soft board, the camera lens is installed in motor center department, and the isolation seat top is equipped with location step, location step embedding motor inner chamber, isolation seat pastes at the middle part and is equipped with glass optical filter, isolation seat pastes the below dress base plate, the base plate pastes all around and is equipped with electric capacity resistance and motor drive IC, the base plate bottom is equipped with the solder ball that a plurality of matrixes distribute, the FPC soft board be equipped with with the corresponding recess in solder ball position, the utility model discloses a novel highpixel image sensor utilizes among the solder ball embedded Groove integratively base plate and the welding of FPC soft board, and image sensor passes through the gold thread and connects the base plate, and the base plate is to FPC soft board accurate transmission data, and the solder ball matrix distributes has a plurality of high pixel demands that satisfy, and high pixel image sensor can obtain better performance, and isolated base can be separated by image sensor and electric capacity resistance, motor drive IC and be left, receives the pollution when avoiding the operation of secondary paster.
(ZH) 本实用新型涉及一种新型高像素影像传感器,包括镜头、马达、玻璃滤光片、隔离座、影像传感器、基板和FPC软板,镜头安装在马达中心处,隔离座上方设有定位台阶,定位台阶嵌入马达内腔,隔离座中部贴装有玻璃滤光片,隔离座下方贴装基板,基板四周贴装有电容电阻和马达驱动IC,基板底部设有多个矩阵分布的焊球,FPC软板设有与焊球位置相对应的凹槽,本实用新型的新型高像素影像传感器利用焊球嵌入凹槽中把基板和FPC软板焊接一体,影像传感器通过金线连接基板,基板向FPC软板精确传输数据,焊球矩阵分布有多个满足高像素需求,高像素影像传感器能够获得更好的性能,隔离底座能够把影像传感器和电容电阻、马达驱动IC相隔离开,避免二次贴片作业时受污染。
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