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1. CA3088977 - ALIGNEMENT PRECIS ET LIAISON PAR TRANSFERT D'UN MOTIF DE PREFORMES DE SOUDURE A UNE SURFACE

Office
Canada
Numéro de la demande 3088977
Date de la demande
Numéro de publication 3088977
Date de publication 20.06.2019
Type de publication A1
CIB
B23K 35/02
BTECHNIQUES INDUSTRIELLES; TRANSPORTS
23MACHINES-OUTILS; TRAVAIL DES MÉTAUX NON PRÉVU AILLEURS
KBRASAGE OU DÉBRASAGE; SOUDAGE; REVÊTEMENT OU PLACAGE PAR BRASAGE OU SOUDAGE; DÉCOUPAGE PAR CHAUFFAGE LOCALISÉ, p.ex. DÉCOUPAGE AU CHALUMEAU; TRAVAIL PAR RAYON LASER
35Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage
02caractérisés par des propriétés mécaniques, p.ex. par la forme
B23K 26/351
BTECHNIQUES INDUSTRIELLES; TRANSPORTS
23MACHINES-OUTILS; TRAVAIL DES MÉTAUX NON PRÉVU AILLEURS
KBRASAGE OU DÉBRASAGE; SOUDAGE; REVÊTEMENT OU PLACAGE PAR BRASAGE OU SOUDAGE; DÉCOUPAGE PAR CHAUFFAGE LOCALISÉ, p.ex. DÉCOUPAGE AU CHALUMEAU; TRAVAIL PAR RAYON LASER
26Travail par rayon laser, p.ex. soudage, découpage ou perçage 
351pour l'ajustage ou l'accord de composants électriques
B23K 26/03
BTECHNIQUES INDUSTRIELLES; TRANSPORTS
23MACHINES-OUTILS; TRAVAIL DES MÉTAUX NON PRÉVU AILLEURS
KBRASAGE OU DÉBRASAGE; SOUDAGE; REVÊTEMENT OU PLACAGE PAR BRASAGE OU SOUDAGE; DÉCOUPAGE PAR CHAUFFAGE LOCALISÉ, p.ex. DÉCOUPAGE AU CHALUMEAU; TRAVAIL PAR RAYON LASER
26Travail par rayon laser, p.ex. soudage, découpage ou perçage 
02Mise en place ou surveillance de la pièce à travailler, p.ex. par rapport au point d'impact; Alignement, pointage ou focalisation du faisceau laser
03Observation, p.ex. surveillance de la pièce à travailler
CPC
B23K 35/0222
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
02characterised by mechanical features, e.g. shape
0222for use in soldering, brazing
B23K 35/264
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
24Selection of soldering or welding materials proper
26with the principal constituent melting at less than 400 degrees C
264Bi as the principal constituent
H01L 39/248
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
39Devices using superconductivity; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
24Processes or apparatus peculiar to the manufacture or treatment of devices provided for in H01L39/00 or of parts thereof
2419the superconducting material comprising copper oxide
248Processes peculiar to the manufacture or treatment of filaments or composite wires
Y02P 80/30
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
80Climate change mitigation technologies for sector-wide applications
30Reducing waste in manufacturing processes; Calculations of released waste quantities
H01B 12/06
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
12Superconductive or hyperconductive conductors, cables, or transmission lines
02characterised by their form
06Films or wires on bases or cores
H01B 13/0036
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
13Apparatus or processes specially adapted for manufacturing conductors or cables
0036Details
Déposants THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY
Données relatives à la priorité 62/598,539 14.12.2017 US
62/598,541 14.12.2017 US
62/728,650 07.09.2018 US
Titre
(EN) PRECISE ALIGNMENT AND DECAL BONDING OF A PATTERN OF SOLDER PREFORMS TO A SURFACE
(FR) ALIGNEMENT PRECIS ET LIAISON PAR TRANSFERT D'UN MOTIF DE PREFORMES DE SOUDURE A UNE SURFACE
Abrégé
(EN)
A method of making precise alignment and decal bonding of a pattern of solder preforms to a surface comprising cutting and placing a length of a solder ribbon onto a semiconductor release tape forming a solder ribbon and semiconductor release tape combination, placing the solder ribbon and semiconductor release tape combination on a vacuum chuck on X-Y stage pair in a laser micromachining system, adjusting the working distance, laser-cutting an outline, peeling off the solder ribbon, allowing the desired solder shape to remain, creating indexing holes, providing a target surface on an alignment fixture with indexing pins, aligning the indexing holes, placing the semiconductor release tape with the desired solder shape on the target surface, pressing the desired solder shape onto the target surface, removing the release tape, and making a pattern of the desired solder shape with precise alignment and decal bonding on the target surface.

Également publié en tant que
JP2020542579