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1. AU2015203651 - LED lighting apparatus

Office
Australie
Numéro de la demande 2015203651
Date de la demande 03.04.2015
Numéro de publication 2015203651
Date de publication 28.07.2016
Type de publication A1
CIB
F21V 29/00
FMÉCANIQUE; ÉCLAIRAGE; CHAUFFAGE; ARMEMENT; SAUTAGE
21ÉCLAIRAGE
VCARACTÉRISTIQUES FONCTIONNELLES OU DÉTAILS FONCTIONNELS DES DISPOSITIFS OU SYSTÈMES D'ÉCLAIRAGE; COMBINAISONS STRUCTURALES DE DISPOSITIFS D'ÉCLAIRAGE AVEC D'AUTRES OBJETS, NON PRÉVUES AILLEURS
29Protection des dispositifs d'éclairage contre les détériorations thermiques; Dispositions de refroidissement ou de chauffage spécialement adaptées aux dispositifs ou systèmes d'éclairage
CPC
F21V 15/01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
15Protecting lighting devices from damage
01Housings, e.g. material or assembling of housing parts
F21V 19/003
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
19Fastening of light sources or lamp holders
001the light sources being semiconductors devices, e.g. LEDs
003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
F21V 29/51
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
50Cooling arrangements
51using condensation or evaporation of a fluid, e.g. heat pipes
F21V 29/70
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
50Cooling arrangements
70characterised by passive heat-dissipating elements, e.g. heat-sinks
F21V 29/77
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
50Cooling arrangements
70characterised by passive heat-dissipating elements, e.g. heat-sinks
74with fins or blades
77with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
F21V 29/80
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
50Cooling arrangements
70characterised by passive heat-dissipating elements, e.g. heat-sinks
80with pins or wires
Déposants ICEPIPE Corporation
Inventeurs Lee, Dong Ju
Mandataires FB Rice Pty Ltd
Données relatives à la priorité 1020140195667 31.12.2014 KR
Titre
(EN) LED lighting apparatus
Abrégé
(EN)
Disclosed is an LED lighting apparatus. An LED lighting apparatus according to one aspect of the present invention comprises: a printed circuit board which is formed in a planar structure; an LED chip which is embedded on one side of the printed circuit board; a support body which is coupled to the other side of the printed circuit board; and a heat sink which is coupled to the support body so as to cool heat generated from the LED chip, wherein the support body has discontinuous through-holes which are formed to penetrate both sides thereof, and a portion of the heat sink is inserted into the through-holes from one side of the support body and is coupled to the support body while being in contact with the printed circuit board.