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1. AU2003225015 - Method for producing vertical tapers in optical waveguides by over polishing

Office
Australie
Numéro de la demande 2003225015
Date de la demande 17.04.2003
Numéro de publication 2003225015
Date de publication 07.08.2003
Type de publication A
CIB
G02B 6/122
GPHYSIQUE
02OPTIQUE
BÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES
6Guides de lumière; Détails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p.ex. des moyens de couplage
10du type guide d'ondes optiques
12du genre à circuit intégré
122Elements optiques de base, p.ex. voies de guidage de la lumière
G02B 6/136
GPHYSIQUE
02OPTIQUE
BÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES
6Guides de lumière; Détails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p.ex. des moyens de couplage
10du type guide d'ondes optiques
12du genre à circuit intégré
13Circuits optiques intégrés caractérisés par le procédé de fabrication
136par gravure
CPC
G02B 6/1228
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
10of the optical waveguide type
12of the integrated circuit kind
122Basic optical elements, e.g. light-guiding paths
1228Tapered waveguides, e.g. integrated spot-size transformers
G02B 6/136
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
10of the optical waveguide type
12of the integrated circuit kind
13Integrated optical circuits characterised by the manufacturing method
136by etching
Déposants INTEL CORPORATION
Inventeurs Salib, Michael
Données relatives à la priorité 10160625 31.05.2002 US
Titre
(EN) Method for producing vertical tapers in optical waveguides by over polishing
Abrégé
(EN) A method to form a vertical waveguide taper in a planar waveguide includes providing a substrate (10), forming a cladding layer (12) or the substrate, forming a core layer (14) on the cladding layer (12) . A protective layer (16B) with an opening is formed on the core layer (14), the opening exposing a portion of the core layer. A chemical mechanical polishing process is performed so that dishing occurs in the exposed portion, forming a depression (31) , in the core (14) with a sloped sidewall. In one embodiment, the core layer (14) is then patterned so that a portion of the core layer is removed to about the depth of the depression. This removed portion includes a part of the core layer containing the depression. The resulting structure includes an unetched sloped surface that transitions to a substantially planar etched surface. The core layer is patterned and etched again to form the waveguide, with the sloped surface forming part of the taper.
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