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1. KR1020080094231 - IMAGE SENSOR MODULE HAVING AN IMAGE PICKUP DEVICE DISPOSED WITHIN A PCB, A CAMERA MODULE COMPRISING THE SAME, AND A METHOD FOR MANUFACTURING THE SAME

Office
République de Corée
Numéro de la demande 1020070038386
Date de la demande 19.04.2007
Numéro de publication 1020080094231
Date de publication 23.10.2008
Numéro de délivrance 1011878990000
Date de délivrance 05.10.2012
Type de publication B1
CIB
H04N 5/335
HÉLECTRICITÉ
04TECHNIQUE DE LA COMMUNICATION ÉLECTRIQUE
NTRANSMISSION D'IMAGES, p.ex. TÉLÉVISION
5Détails des systèmes de télévision
30Transformation d'informations lumineuses ou analogues en informations électriques
335utilisant des capteurs d'images à l'état solide  
H01L 27/146
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
27Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun
14comprenant des composants semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement en énergie électrique, soit comme dispositifs de commande de l'énergie électrique par ledit rayonnement
144Dispositifs commandés par rayonnement
146Structures de capteurs d'images
H04N 5/225
HÉLECTRICITÉ
04TECHNIQUE DE LA COMMUNICATION ÉLECTRIQUE
NTRANSMISSION D'IMAGES, p.ex. TÉLÉVISION
5Détails des systèmes de télévision
222Circuits de studio; Dispositifs de studio; Equipements de studio
225Caméras de télévision
CPC
H01L 27/1469
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
1469Assemblies, i.e. hybrid integration
H04N 5/2257
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
2257Mechanical and electrical details of cameras or camera modules for embedding in other devices
H05K 13/00
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
H04N 5/335
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
30Transforming light or analogous information into electric information
335using solid-state image sensors [SSIS]
H05K 3/4611
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multilayer circuits
4611by laminating two or more circuit boards
G02B 5/208
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
5Optical elements other than lenses
20Filters
208for use with infra-red or ultraviolet radiation, e.g. for separating visible light from infra-red and/or ultraviolet radiation
Déposants SAMSUNG TECHWIN CO., LTD.
삼성테크윈 주식회사
Inventeurs GO, HYUN MIN
고현민
HANAI NOBUHIRO
하나이 노부히로
Mandataires 리앤목특허법인
Titre
(EN) IMAGE SENSOR MODULE HAVING AN IMAGE PICKUP DEVICE DISPOSED WITHIN A PCB, A CAMERA MODULE COMPRISING THE SAME, AND A METHOD FOR MANUFACTURING THE SAME
(KO) 이미지 센서 모듈과 이를 구비한 카메라 모듈 및 그 제조방법
Abrégé
(EN)
PURPOSE: An image sensor module, a camera module comprising the same, and a method for manufacturing the same are provided to disposed an image pickup device within a PCB(Printed Circuit Board), thereby reducing the thickness of the camera module. CONSTITUTION: A camera module(100) comprises an image sensor module(110) and an optical system(120). The image sensor module includes a PCB(111), an image pickup device(112), a bump ball(113), an adhesive member(114), an IR filter(115), and a pad(116). The image pickup device is disposed within the PCB. In the camera module, the image pickup device is separately joined to an upper side of the PCB. The IR filter is joined to one side of the optical system disposed above the PCB and the image pickup device. A light transmission region is formed in a central portion of a first layer, which constitutes an uppermost layer of the PCB. The image pickup device is mounted on a peripheral portion where the light transmission region is formed in the first layer. ©KIPO 2008

(KO)
본 발명은 이미지 센서 모듈 및 이를 구비한 카메라 모듈에 관한 것으로, 상세하게는 모듈의 박형화를 위하여 촬상소자를 인쇄회로기판에 내장한 이미지 센서 모듈 및 이를 구비한 카메라 모듈에 관한 것이다.