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1. WO2002029373 - PROCEDE ET APPAREIL DE FABRICATION D'UNE CELLULE DE PESAGE

Note: Texte fondé sur des processus automatiques de reconnaissance optique de caractères. Seule la version PDF a une valeur juridique

[ EN ]

CT ATMS

1. A method for making a load cell having a sensor portion and a circuit board portion comprising the steps of:
(a) providing an assembly including a conductive material member and a non-conductive material member; and
(b) applying a photo-imaging process to one of the conductive or non-conductive material members to form a conductive path between the sensor portion and the circuit board portion.

2. The method according to claim 1 wherein the photo-imaging process is an additive process including the steps of applying a photo-reactive film to the non-conductive material member, exposing the film to a light source to produce a predetermined pattern for accepting the conductive material member, and adding the conductive material member to the pattern to from the load cell.

3. The method according to claim 1 wherein the photo-imaging process is a subtractive process including the steps of laying the conductive material on the non-conductive material in a predetermined pattern, applying a photo-reactive film to the conductive material, exposing portions of the film to a light source to define first portions that are exposed to light and second portions that are not exposed to light wherein the first portions bond the conductive material member to the non-conductive material member and the second portions are non-reactive, and etching the second portions to remove non-bonded conductive material.

4. The method according to claim 3 including the step of applying a cleaning film to the conductive and non-conductive material members to remove any remaining photo-reactive film.

5. The method according to claim 1 including forming the sensor portion, conductive path, and circuit board portion as one piece with the photo-imaging process.

6. The method according to claim 5 wherein the conductive material member is formed from a metal foil having a first portion that forms the sensor portion and a second portion that forms the circuit board portion.

7. The method according to claim 6 wherein the first portion is thinner than the second portion.

8. The method according to claim 7 wherein the first portion is approximately .001 inches thick and the second portion is approximately .01 inches thick.

9. A method for making a load cell having a sensor portion and a circuit board portion comprising the steps of:
(a) applying a layer of conductive material over a layer of non-conductive material in a predetermined pattern including a sensor portion, a circuit board portion, and a conductive path connecting the sensor and circuit board portions;
(b) applying a photo-reactive film to the conductive material;
(c) exposing portions of the photo-reactive film to a light source to bond the conductive material to the non-conductive material to integrally form the sensor portion, the circuit board portion, and the conductive path as one piece.

10. The method according to claim 9 wherein the light source is applied through a negative to define exposed portions of the photo-reactive film in which the conductive material is bonded to the non-conductive material and non-exposed portions of the photo-reactive film in which the conductive material is not bonded to the non-conductive material and including the step of removing the non-exposed portions of the photo-reactive film and the associated conductive material underneath the non-exposed portions.

11. The method according to claim 10 including the step of applying a cleaning material to the conductive and non-conductive materials to remove any remaining photo-reactive film.

12. The method according to claim 10 wherein the negative defines a load cell pattern including the sensor portion, the circuit board portion, and the conductive path.

13. The method according to claim 9 wherein the conductive material is comprised of a metal foil with the circuit board portion having a greater thickness than the sensor portion.

14. A load cell comprising:
a non-conductive layer; and
a conductive layer overlaid on said non-conductive layer and including a sensor, a circuit board member, and a connector extending from said sensor to said circuit board to transmit electrical signals from said sensor to said circuit board wherein at least one of said sensor or circuit board is integrally formed as one piece with said connector.

15. A load cell according to claim 14 wherein said conductive layer is bonded to said non-conductive layer via a photo-imaging process.

16. A load cell according to claim 15 wherein said conductive layer is a metallic foil having a sensor portion having a first thickness and a circuit board portion having a second thickness that is greater than the first thickness.

17. A load cell according to claim 16 wherein said first thickness is approximately .001 inches and said second thickness is approximately .01 inches.

18. A load cell according to claim 14 wherein said sensor, circuit board, and connector are integrally formed as one piece.