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1. WO2011063224 - SYSTÈME D'ASSEMBLAGE ET DE MISE SOUS BOÎTIER DE LASERS À SEMI-CONDUCTEURS

Note: Texte fondé sur des processus automatiques de reconnaissance optique de caractères. Seule la version PDF a une valeur juridique

[ EN ]

CLAIMS

What is claimed is:

1. A laser system, comprising:

a heat exchanger having a bore extending through the heat exchanger;

a carrier on which a semiconductor gain chip is mounted, at least part of the carrier being mounted in the bore; and

lens mounted on the heat exchange and over the bore.

2. A system as claimed in claim 1, wherein the carrier comprises a base and a mount, the base covering one end of the bore and the mount extending into bore and holding the semiconductor gain chip.

3. A system as claimed in claim 2, wherein the mount comprises peripheral extensions that increase a contact surface between the carrier and the heat exchanger.

4. A system as claimed in claim 1, wherein a mechanical interface between the carrier and the heat exchanger rotationally align the carrier with respect to the heat exchanger.

5. A system as claimed in claim 1, wherein the heat exchanger comprises fins.

6. A system as claimed in claim 1, wherein the heat exchanger comprises radially extending fins.

7. A system as claimed in claim 1, heat exchanger is mechanically attached to a heat sink.

8. A system as claimed in claim 1, wherein said base sets a depth of engagement with the heat exchanger.

9. A system as claimed in claim 1, wherein the carrier comprises a heat-spreading pedestal onto which the semiconductor gain chip is mounted.

10. A system as claimed in claim 1, wherein components are mutually self-aligned at least in part by their radial centering within a cavity in at least one component.

11. A system as claimed in claim 1 ,wherein components are not functionally rotationally symmetric so as to be joined in a predetermined rotational position with respect to the rest of the system.

12. A system as claimed in claim 1, further comprising a volumetric bragg element is affixed to the mount.

13. A system as claimed in claim 1, further comprising a diffractive optical element is affixed to the mount.

14. A system as claimed in claim 1, wherein the mount comprises peripheral extensions that subtend an angle of at least about 200 degrees with respect to the central axis of the mount.

15. A system as claimed in claim 1, further comprising a fan for flowing air over the heat exchanger.

16. A system as claimed in claim 1, wherein the lens is aspheric, cylindrical or toric.

17. A system as claimed in claim 1, wherein the carrier is a TO-style can, and the semiconductor gain chip is mounted on a pedestal of the TO-style can at a location such that the laser facet is centered in the system when the assembly is completed.

18. A system as claimed in claim 1, further comprising a fan for flowing air over the area that the laser light is projected onto.

19. A system as claimed in claim 1, further comprising a fan for flowing air over the skin of a patient at which the laser light is projected.

20. A method for assembling high powered semiconductor laser systems to provide lasers which are passively or self- aligned and have predefined focal points or imaging planes without post-fabrication adjustment, wherein the method comprises:

affixing a semiconductor laser chip to a carrier, said carrier having power connections and heat spreading means;

placing said carrier into a heat-exchanging relationship with a heat exchanger,

whereby said heat exchanger and said carrier are passively or self aligning into an efficient heat exchanging contact; and

affixing an optical element to one or both of said heat exchanger for said diode laser, and said carrier;

wherein laser systems produced by said method each have at least one output laser beam from each semiconductor laser chip, each beam having a predefined direction of propagation without post-fabrication adjustment.

21. The method of assembling of claim 20, wherein said chip is connected to said carrier via a heat-spreading mount attached to a body of said carrier.

22. The method of assembling of claim 21, wherein said mount has a body which sets the depth of engagement with the heat exchanger.

23. The method of assembling of claim 22, wherein

said mount has a body which sets the depth of engagement with the heat exchanger, and

said heat exchanger has a central bore, and the outer surface of the bore-entering

portion of said mount and the inner surface of said bore are constructed to create close proximity between their surfaces, upon assembly, to allow efficient heat transfer between said laser diode and said heat exchanger.

24. The method of assembling of claim 21 wherein said laser chip is mounted onto a heat-spreading pedestal portion of said mount.

25. The method of assembling of claim 20 wherein the components are mutually self-aligned at least in part by their radial centering within a cavity in at least one component.

26. The method of assembling of claim 20 wherein a fan is attached to said system to increase heat removal.

27. The method of assembling of claim 20 wherein each component which is not functionally rotationally symmetric is self-aligning during the assembly process so as to be joined in a predetermined rotational position with respect to the rest of the system.

28. The method of assembling of claim 20 wherein said mount has peripheral extensions functioning as heat spreaders to increase the heat transfer rate between the mount and the heat exchanger.

29. The method of assembling of claim 28 wherein the mount plus said peripheral extensions subtend an angle of at least about 200 degrees with respect to the central axis of said carrier.

30. The method of assembling of claim 20 wherein positioning of one or both of the heat exchange means and the carrier is obtained by the use of detents.

31. The method of assembling of claim 20 wherein fins projecting outwardly from the center of the device are provided to increase the efficiency of heat exchange or removal.

32. The method of assembling of claim 31 wherein at least some of said fins have T-shaped terminations to increase the rate of heat removal.

33. The method of assembling of claim 31 wherein said method further comprises a basis for clocking by providing at least one of said fins to be distinguishable from other fins in shape or location.

34. The method of assembling of claim 20 further comprising increasing heat removal by providing an adaptor for connecting a fan to said system.

35. The method of assembling of claim 20 wherein alignment of said carrier, said heat exchanger, and at least one optical element, is achieved by clocking.

36. The method of assembling of claim 20 wherein at least one lens is aspheric, cylindrical or toric.

37. The method of assembling of claim 20, wherein the laser facet is centered in the system when the assembly is completed by affixing said laser to a location on said carrier in a location that will be centered after the mutual alignment of said carrier and said heat exchanger.

38. The method of assembling of claim 20, wherein said mount is assembled so as to be thermally mated to a cavity inside a heat removal element that is fastened to an apparatus.

39. A method for assembling semiconductor laser systems to provide lasers which are self- aligned and have predefined focal distances or imaging planes, without post-fabrication adjustment, wherein the method comprises:

affixing a semiconductor laser chip to a carrier; and

placing said carrier into a heat-exchanging relationship with a heat exchanger,

wherein said heat exchanger and said carrier are self aligning into a heat exchanging contact.

40. A method for assembling optical systems which are self- aligned and have predefined focal distances or imaging planes, without post-fabrication adjustment, wherein the method comprises

affixing an optical element to a heat exchanger for a diode laser; and

placing said optical element into a heat-exchanging relationship with a heat

exchanger, wherein said heat exchanger and said optical element are self aligning into a heat exchanging contact.

41. A laser diode mounting system, the system comprising:

a semiconductor laser;

at least one heat spreading member;

a heat exchanger;

and at least one optical component, said optical component affixed to one or more of said carrier and said heat exchanger;

wherein the lasers produced by said method each have an output laser beam from said semiconductor laser chip, each beam having a predefined direction of propagation without adjustment.

42. A housing system, which acts as an enclosure for a laser system, with at least one contact located at the interface where the light is emitted, which when enabled, permits operation of the laser assembly

43. A contact of claim 42 that is enabled by a rolling motion.

44. A contact of claim 42 that is enabled by a pressure sensor.

45. An emitted light of claim 42 where the optical emission is proportionally controlled by feedback from the contact.