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1. US20090165557 - Angular velocity sensor

Note: Texte fondé sur des processus automatiques de reconnaissance optique de caractères. Seule la version PDF a une valeur juridique

[ EN ]

Claims

1. An angular velocity sensor comprising:
a substrate having an upper surface, the upper surface having a first recess provided therein;
an electronic component mounted in the first recess; and
a first vibration element mounted onto the upper surface of the substrate and connected electrically to the electronic component, the first vibration element having a portion located directly above the electronic component.
2. The angular velocity sensor of claim 1, further comprising an electrode provided on a bottom of the first recess, wherein the electronic component includes
a lower surface facing the bottom of the first recess; and
a terminal provided on the lower surface of the electronic component, the terminal being joined to the electrode.
3. The angular velocity sensor of claim 1, wherein
the first vibration element has a tuning fork shape including a plurality of legs and a base, the plurality of legs having respective ends, the base being connected to the respective ends of the plurality of legs, and
the portion of the first vibration element includes at least a portion of the plurality of legs.
4. The angular velocity sensor of claim 1, further comprising a second vibration element mounted onto the substrate, wherein
the first vibration element has a first detection axis for detecting an angular velocity, and
the second vibration element has a second detection axis perpendicular to the first detection axis.
5. The angular velocity sensor of claim 4, wherein the upper surface of the substrate has a second recess provided therein, the second recess being located beneath the second vibration element, the second recess being shallower than the first recess, the second recess communicating with the first recess.
6. The angular velocity sensor of claim 5, wherein
the upper surface of the substrate has a joint portion joined to the second vibration element, and
the second recess is located between the joint portion and the first recess.
7. The angular velocity sensor of claim 4, further comprising:
a case mounted to the upper surface of the substrate, the case covering the first vibration element, the second vibration element, and the first recess; and
an adhesive for joining the case to the upper surface of the substrate such that a gap is provided between the case and the upper surface of the substrate.
8. The angular velocity sensor of claim 4, further comprising:
an electrode provided on the upper surface of the substrate;
a component connected to the electrode;
a conductive adhesive for joining the component to the electrode, the conductive adhesive containing thermosetting resin;
a first adhesive for joining the second vibration element to the upper surface of the substrate, the first adhesive being made of thermosetting resin; and
a second adhesive for joining the electronic component to the recess, the second adhesive being made of thermosetting resin.
9. The angular velocity sensor of claim 1, further comprising an adhesive for joining the electronic component to the first recess, wherein the first recess has
a mounting portion facing the electronic component; and
an injection portion communicating with the mounting portion and exposed from the electronic component, the injection portion allowing the adhesive to inject thereto.
10. The angular velocity sensor of claim 9, wherein the upper surface of the substrate has a second recess provided therein, the second recess being located beneath the first vibration element, the second recess being shallower than the first recess and directly and communicating directly with the injection portion of the first recess.
11. The angular velocity sensor of claim 10, wherein
the upper surface of the substrate has a joint portion joined to the first vibration element; and
the second recess is located between the joint portion and the first recess.
12. The angular velocity sensor of claim 1, wherein the upper surface of the substrate has a second recess provided therein, the second recess being located beneath the first vibration element, the second recess being shallower than the first recess and communicating with the first recess.
13. The angular velocity sensor of claim 12, wherein
the upper surface of the substrate has a joint portion joined to the first vibration element, and
the second recess is located between the joint portion and the first recess.
14. The angular velocity sensor of claim 1, further comprising:
a case mounted to the upper surface of the substrate, the case covering the first vibration element and the first recess; and
an adhesive for joining the case to the upper surface of the substrate such that a gap is provided between the upper surface of the substrate and the case.
15. The angular velocity sensor of claim 1, further comprising:
an electrode provided on the upper surface of the substrate;
a component connected to the electrode;
a conductive adhesive for joining the component to the electrode, the conductive adhesive containing thermosetting resin;
a first adhesive for joining the first vibration element to the upper surface of the substrate, the first adhesive being made of thermosetting resin; and
a second adhesive for joining the electronic component to a bottom of the recess, the second adhesive being made of thermosetting resin.
16. A method for manufacturing an angular velocity sensor, comprising:
providing a substrate having an upper surface, the upper surface having a recess provided therein;
mounting an electronic component in the recess;
mounting a first vibration element onto the upper surface of the substrate, the first vibration element having a portion located directly above the electronic component; and
forming a sensor circuit by electrically connecting the first vibration element to the electronic component.
17. The method of claim 16, wherein
the electronic component has a lower surface facing a bottom of the recess, the lower surface of the electronic component having a terminal provided thereon, said method further comprising providing an electrode on the bottom of the recess, and
said mounting of the electronic component in the recess comprises joining the terminal of the electronic component to the electrode.
18. The method of claim 16, further comprising mounting a case to the upper surface of the substrate such that a gap is provided between the case and the upper surface of the substrate, the case covering the first vibration element, the recess, and the electronic component.
19. The method of claim 18, wherein
the case includes
a cover plate located directly above the first vibration element and the recess, the cover plate having an outer periphery; and
a side wall extending from the outer periphery of the cover plate, the side wall having a lower end facing the upper surface of the substrate,
said mounting of the case to the upper surface of the substrate comprises:
applying an adhesive to a first portion of the lower end of the side wall of the case such that the adhesive is not applied to a second portion of the lower end; and
attaching the first portion of the lower end to the upper surface of the substrate with the applied adhesive such that the gap is provided between the upper surface of the substrate and the second portion of the lower end.
20. The method of claim 16, wherein
said mounting of the electronic component in the recess comprises mounting the electronic component in the recess with a first adhesive made of thermosetting resin, and
said mounting of the first vibration element comprises mounting the first vibration element with a second adhesive made of thermosetting resin, said method further comprising:
providing an electrode on the upper surface of the substrate;
mounting a component onto the electrode with a conductive adhesive; and
curing the first adhesive and the second adhesive.
21. The method of claim 20, wherein
the conductive adhesive contains thermosetting resin; and
said curing of the first adhesive and the second adhesive comprises, after said mounting of the component to the electrode with the conductive adhesive, heating the first adhesive, the second adhesive, and the conductive adhesive simultaneously so as to cure the first adhesive, the second adhesive, and the conductive adhesive.
22. The method of claim 20, wherein
the conductive adhesive contains metal, and
said curing of the first adhesive and the second adhesive comprises heating the first adhesive and the second adhesive at a predetermined temperature for a predetermined duration,
said method further comprising, after said heating of the first adhesive and the second adhesive at the predetermined temperature for the predetermine duration, heating and melting the conductive adhesive at a temperature higher than the predetermined temperature for a duration shorter than the predetermined duration.
23. The method of claim 20, wherein
the conductive adhesive contains metal; and
said curing of the first adhesive and the second adhesive comprises heating the first adhesive and the second adhesive at a predetermined temperature for a predetermined duration,
said method further comprising, consecutively after said heating of the first adhesive and the second adhesive at the predetermined temperature for the predetermined duration, heating and melting the conductive adhesive at a temperature higher than the predetermined temperature for a duration shorter than the predetermined duration.
24. The method of claim 23, wherein said heating of the first adhesive and the second adhesive at the predetermined temperature for the predetermined duration is executed after said mounting the component to the electrode with the conductive adhesive.
25. The method of claim 20,
wherein the electronic component has a lower surface facing a bottom of the recess, the lower surface having a terminal provided thereon, said method further comprising providing an electrode on the bottom of the recess,
said mounting of the electronic component in the recess further comprises joining the terminal of the electronic component to the electrode, and
said mounting of the electronic component in the recess with the first adhesive comprises, after said joining of the terminal of the electronic component to the electrode, putting the first adhesive between the electronic component and the bottom of the recess.
26. The method of claim 20, further comprising providing an electrode on the upper surface of the substrate, wherein said forming of the sensor circuit comprises, after said curing of the first adhesive and the second adhesive, connecting the first vibration element to the electrode via a wire.
27. The method of claim 16, further comprising mounting a second vibration element onto the upper surface of the substrate, wherein
the first vibration element has a first detection axis for detecting an angular velocity; and
the second vibration element has a second detection axis for detecting an angular velocity, the second detection axis perpendicular to the first detection axis.
28. The method of claim 16, further comprising:
preparing a sheet substrate including a plurality of chip substrates connected to each other; and
dividing the sheet substrate into the plurality of chip substrates,
wherein each of the plurality of chip substrates constitutes the substrate.
29. The method of claim 28, further comprising:
detecting a characteristic of the sensor circuit by rotating the sheet substrate; and
adjusting the sensor circuit based on the detected characteristic,
wherein said dividing of the sheet substrate is executed after said adjusting of the sensor circuit.
30. The method of claim 29, further comprising mounting a case to the upper surface of the substrate after said adjusting of the sensor circuit, the case covering the first vibration element, the recess, and the electronic component, wherein said dividing of the sheet substrate is executed after said mounting of the case.
31. The method of claim 30, wherein said mounting of the case to the upper surface of the substrate comprises mounting the case to the upper surface of the substrate such that a gap is provided between the case and the upper surface of the substrate.
32. The method of claim 29, further comprising mounting a second vibration element to the upper surface of the substrate, wherein
the first vibration element has a first detection axis for detecting an angular velocity,
the second vibration element has a second detection axis for detecting an angular velocity, the second detection axis being perpendicular to the first detection axis, and
said detecting of the characteristic of the sensor circuit comprises detecting the characteristic of the sensor circuit by rotating the sheet substrate at a rotation axis angled by 45 degrees with respect to the first detection axis and the second detection axis.