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1. WO2008007860 - PROCÉDÉ DE FABRICATION DE DISSIPATEUR THERMIQUE POUR MODULE MÉMOIRE

Note: Texte fondé sur des processus automatiques de reconnaissance optique de caractères. Seule la version PDF a une valeur juridique

[ EN ]

Claims
[1] A method of manufacturing a heat sink for a memory module, the method
comprising cutting and detaching the heat sink from a metal plate coil by using a press device,
in which the heat sinks 11 are connected to a heat sink molded sheet 10 at a predetermined interval through a bridge 12, and are detached from the heat sink
molded sheet 10 by the press device.
[2] The method as claimed in claim 1, further comprising
painting the heat sink molded sheet 10 after the cutting and detaching steps;
adhering an adhesive pad 5 to the painted heat sink molded sheet 10; and
separating the heat sink by cutting the bridge 12.
[3] The method as claimed in claim 1, wherein the bridge 12 of the heat sink molded sheet 10 consists of first bridges 12a connected to left and right ends of the heat sink 11, and second bridges 12b connected to the first bridges 12a to maintain an arranging interval of the heat sinks 11.
[4] The method as claimed in claim 1, wherein in the cutting and detaching steps, a cut line 12c is formed on each front end of the first bridges 12a, and through- holes 12d are formed on the second bridge 12b at a predetermined pitch.