Traitement en cours

Veuillez attendre...

Paramétrages

Paramétrages

Aller à Demande

1. WO2019118650 - ALIGNEMENT PRÉCIS ET LIAISON PAR TRANSFERT D'UN MOTIF DE PRÉFORMES DE SOUDURE À UNE SURFACE

Note: Texte fondé sur des processus automatiques de reconnaissance optique de caractères. Seule la version PDF a une valeur juridique

[ EN ]

Claims

What we claim is:

1. A method of making precise alignment and decal bonding of a pattern of solder preforms to a surface comprising:

cutting and placing a length of a solder ribbon onto a semiconductor release tape forming a solder ribbon and semiconductor release tape combination;

placing the solder ribbon and semiconductor release tape combination on a vacuum chuck on an X-Y stage pair in a laser micromachining system;

adjusting the working distance of the galvo from the solder ribbon of the solder ribbon and semiconductor release tape combination by focusing the optical image on camera;

laser-cutting an outline or perimeter of a desired solder shape pattern of elements on the solder ribbon and semiconductor release tape combination;

creating indexing holes through the release tape while maintaining the spatial alignment of the solder ribbon and semiconductor release tape combination;

peeling off the solder ribbon from the semiconductor release tape;

allowing the desired solder shape pattern of elements to remain on the semiconductor release tape; providing a target or receiving surface on an alignment fixture with indexing pins;

aligning the indexing holes on the release tape with the indexing pins of the alignment fixture;

placing the semiconductor release tape with the desired solder shape pattern of elements on a target surface;

pressing the desired solder shape pattern of elements onto the target surface;

removing the release tape; and

making a pattern of the desired solder shape pattern of elements with precise alignment and decal bonding on the target surface.

2. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1

wherein the step of laser-cutting an outline or perimeter of a desired solder shape is to a depth that maintains the integrity of the release tape.

3. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1

wherein the step of laser-cutting an outline or perimeter of a desired solder shape is to a depth to the surface of the release tape.

4. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 3

wherein the creating indexing holes through the release tape is by laser cutting.

5. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1

wherein the target surface has target surface indexing holes and

further comprising the step of

aligning the indexing holes with the target surface indexing holes.

6. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1

further comprising the step of

aligning the indexing holes with indexing pins on a reel.

7. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1

further comprising the step of

utilizing the method in a reel-to-reel system.

8. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1

wherein the step of removing the release tape is by mechanical, thermal, or photonic means.

9. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1 further comprising the steps of:

placing a receiving sample with the bonding surface face up over the indexing pins on an alignment jig; aligning the indexing holes on the release tape with the indexing pins of the alignment jig;

emplacing the release tape with the solder preforms facing the receiving sample;

pressing the solder preforms onto the surface; and

removing the release tape by mechanical, thermal, or photonic means.

10. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1

further comprising the step of

making solder bonds of an electronic circuit on a flexible substrate.

11. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1 wherein the solder preforms are placed on a surface with less than 50 microns spatial accuracy.

12. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1

further comprising the step of

bonding electrical elements or structures originating from separate layers.

13. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 1

further comprising the step of

bonding superconducting elements or structures originating from separate layers.

14. The method of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 6

wherein an alignment jig aligns and assembles separate components on a 2-D planar or 3-D curved surface with precision.

15. The product of the process of making precise alignment and decal bonding of a pattern of solder preforms to a surface comprising the steps of:

cutting and placing a length of a solder ribbon onto a semiconductor release tape forming a solder ribbon and semiconductor release tape combination;

placing the solder ribbon and semiconductor release tape combination on a vacuum chuck on X-Y stage pair in a laser micromachining system;

adjusting the working distance of the galvo from the solder ribbon of the solder ribbon and semiconductor release tape combination by focusing the optical image on camera;

laser-cutting an outline or perimeter of a desired solder shape pattern on the solder ribbon and semiconductor release tape combination;

creating indexing holes through the release tape while maintaining the spatial alignment of the solder ribbon and semiconductor release tape combination;

peeling off the solder ribbon from the semiconductor release tape;

allowing the desired solder shape elements to remain on the semiconductor release tape;

providing a target surface on an alignment fixture with indexing pins;

aligning the indexing holes on the release tape with the indexing pins of the alignment fixture;

placing the semiconductor release tape with the desired solder shape elements on the target surface; pressing the desired solder shape elements onto the target surface;

removing the release tape; and

making a pattern of the desired solder shape elements with precise alignment and decal bonding on the target surface.

16. The product of the process of making precise alignment and decal bonding of a pattern of solder preforms to a surface of claim 15 further comprising the steps of:

placing a receiving sample with the bonding surface face up over the indexing pins on an alignment jig; aligning the indexing holes on the release tape with the indexing pins of the alignment jig;

emplacing the release tape with the solder preforms facing the receiving sample;

pressing the solder preforms onto the surface; and

removing the release tape by mechanical, thermal, or photonic means.