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1. CN109801874 - Via hole structure, manufacturing method of via hole structure, electronic device and display device

Office
Chine
Numéro de la demande 201910098927.6
Date de la demande 31.01.2019
Numéro de publication 109801874
Date de publication 24.05.2019
Type de publication A
CIB
H01L 21/768
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
21Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
70Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun, ou de parties constitutives spécifiques de ceux-ci; Fabrication de dispositifs à circuit intégré ou de parties constitutives spécifiques de ceux-ci
71Fabrication de parties spécifiques de dispositifs définis en H01L21/7089
768Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
CPC
G06F 3/04164
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
3Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01Input arrangements or combined input and output arrangements for interaction between user and computer
03Arrangements for converting the position or the displacement of a member into a coded form
041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
0416Control or interface arrangements specially adapted for digitisers
04164Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
H01L 21/76804
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
71Manufacture of specific parts of devices defined in group H01L21/70
768Applying interconnections to be used for carrying current between separate components within a device ; comprising conductors and dielectrics
76801characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
76802by forming openings in dielectrics
76804by forming tapered via holes
H01L 21/76814
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
71Manufacture of specific parts of devices defined in group H01L21/70
768Applying interconnections to be used for carrying current between separate components within a device ; comprising conductors and dielectrics
76801characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
76802by forming openings in dielectrics
76814post-treatment or after-treatment, e.g. cleaning or removal of oxides on underlying conductors
G06F 3/0412
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
3Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01Input arrangements or combined input and output arrangements for interaction between user and computer
03Arrangements for converting the position or the displacement of a member into a coded form
041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
0412Digitisers structurally integrated in a display
H01L 21/486
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
4814Conductive parts
4846Leads on or in insulating or insulated substrates, e.g. metallisation
486Via connections through the substrate with or without pins
H01L 21/76816
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
71Manufacture of specific parts of devices defined in group H01L21/70
768Applying interconnections to be used for carrying current between separate components within a device ; comprising conductors and dielectrics
76801characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
76802by forming openings in dielectrics
76816Aspects relating to the layout of the pattern or to the size of vias or trenches
Déposants MIANYANG BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
绵阳京东方光电科技有限公司
BOE TECHNOLOGY GROUP CO., LTD.
京东方科技集团股份有限公司
Inventeurs ZHANG LEI
张雷
SUN DAQING
孙大庆
QIU WEI
邱伟
YAN FANGLIANG
闫方亮
Mandataires 北京三高永信知识产权代理有限责任公司 11138
Titre
(EN) Via hole structure, manufacturing method of via hole structure, electronic device and display device
(ZH) 过孔结构及其制造方法、电子器件、显示装置
Abrégé
(EN)
The invention relates to a via hole structure, a manufacturing method thereof, an electronic device and a display device, and belongs to the technical field of electronics. The via hole structure comprises a first conductive layer, an interlayer insulating layer and a second conductive layer which are sequentially arranged. The interlayer insulating layer is provided with a via hole. The inner wall surface of the via hole is an uneven curved surface. The second conductive layer is in lap joint with the first conductive layer through the via hole. According to the invention, the part, located in the via hole, of the second conductive layer is prevented from falling off, so that poor lap joint between the second conductive layer and the first conductive layer is avoided. The invention is applied to the overlapping of conductive layers.

(ZH)
本发明是关于一种过孔结构及其制造方法、电子器件、显示装置,属于电子技术领域。所述过孔结构包括:依次设置的第一导电层、层间绝缘层和第二导电层,所述层间绝缘层具有过孔,所述过孔的内壁面为凹凸不平的曲面,所述第二导电层通过所述过孔与所述第一导电层搭接。本发明避免了第二导电层位于过孔内的部分脱落,从而避免了第二导电层与第一导电层出现搭接不良。本发明用于导电层的搭接。

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