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1. CN101400970 - Angular velocity sensor, method of manufacturing the same, and electronic device using the angular velocity sensor

Office
Chine
Numéro de la demande 200780008859.5
Date de la demande 07.03.2007
Numéro de publication 101400970
Date de publication 01.04.2009
Numéro de délivrance 101400970
Date de délivrance 27.03.2013
Type de publication B
CIB
G01C 19/5607
GPHYSIQUE
01MÉTROLOGIE; TESTS
CMESURE DES DISTANCES, DES NIVEAUX OU DES RELÈVEMENTS; GÉODÉSIE; NAVIGATION; INSTRUMENTS GYROSCOPIQUES; PHOTOGRAMMÉTRIE OU VIDÉOGRAMMÉTRIE
19Gyroscopes; Dispositifs sensibles à la rotation utilisant des masses vibrantes; Dispositifs sensibles à la rotation sans masse en mouvement; Mesure de la vitesse angulaire en utilisant les effets gyroscopiques
56Dispositifs sensibles à la rotation utilisant des masses vibrantes, p.ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis
5607utilisant des diapasons vibrants
G01C 19/5628
GPHYSIQUE
01MÉTROLOGIE; TESTS
CMESURE DES DISTANCES, DES NIVEAUX OU DES RELÈVEMENTS; GÉODÉSIE; NAVIGATION; INSTRUMENTS GYROSCOPIQUES; PHOTOGRAMMÉTRIE OU VIDÉOGRAMMÉTRIE
19Gyroscopes; Dispositifs sensibles à la rotation utilisant des masses vibrantes; Dispositifs sensibles à la rotation sans masse en mouvement; Mesure de la vitesse angulaire en utilisant les effets gyroscopiques
56Dispositifs sensibles à la rotation utilisant des masses vibrantes, p.ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis
5607utilisant des diapasons vibrants
5628Fabrication; Ajustage; Montage; Boîtiers
CPC
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2924/16152
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
15Details of package parts other than the semiconductor or other solid state devices to be connected
161Cap
1615Shape
16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap
H01L 2924/19105
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
191Disposition
19101of discrete passive components
19105in a side-by-side arrangement on a common die mounting substrate
Déposants Matsushita Electric Ind Co., Ltd.
松下电器产业株式会社
Inventeurs Ueda Shinjiro
上田真二郎
Mouri Hiroaki
毛利浩明
Nakashima Koichi
中岛耕一郎
Mandataires duan chengen yang guangjun
北京市中咨律师事务所 11247
北京市中咨律师事务所 11247
Titre
(EN) Angular velocity sensor, method of manufacturing the same, and electronic device using the angular velocity sensor
(ZH) 角速度传感器及其制造方法以及使用该角速度传感器的电子设备
Abrégé
(EN) An angular velocity sensor comprises a substrate having an upper surface in which a recess is formed, an electronic part mounted in the recess, and a vibrating element mounted on the upper surface of the substrate. The vibrating element include portions positioned just above the electronic part. The angular velocity sensor can be miniaturized.
(ZH)

本发明提供一种角速度传感器,其具备:基板,其具有形成有凹部的上表面;电子部件,其装配在该凹部内;以及振动元件,其安装在所述基板的所述上表面上。该振动元件具有位于所述电子部件的正上方的部分。该角速度传感器可以小型化。