Traitement en cours

Veuillez attendre...

Paramétrages

Paramétrages

Aller à Demande

1. WO2008002944 - MÉTHODOLOGIE À JOINT FLEXIBLE POUR ATTACHER UNE MATRICE SUR UN SUBSTRAT ORGANIQUE

Note: Texte fondé sur des processus automatiques de reconnaissance optique de caractères. Seule la version PDF a une valeur juridique

[ EN ]

CLAIMS
What is claimed is:

1. An integrated circuit chip package substrate comprising:
an organic substrate;
an interposer coupled with a surface of the organic substrate, the interposer having cavities to accept bumps of a die; and
a flexible tape layer coupled with a surface of the interposer, the flexible tape to couple with bumps of the die.

2. The integrated circuit chip package substrate of claim 1, further comprising the flexible tape including slits creating flaps that fold into the cavities when coupled with bumps of the die.

3. The integrated circuit chip package substrate of claim 1, wherein the interposer comprises ceramic material.

4. The integrated circuit chip package substrate of claim 1, wherein the interposer comprises plating of a metal chosen from the group consisting of: nickel, copper, gold, silver, tungsten, and conductive alloys.

5. The integrated circuit chip package substrate of claim 1, wherein the interposer comprises a layer of the substrate.

6. An apparatus comprising:
an integrated circuit die, the integrated circuit die including bumps for electrical coupling;
a thermal interface material layer deposited on a surface of the die;
an integrated heat spreader coupled with the thermal interface material layer;
a flexible tape layer coupled with the bumps of the die; and
an interposer, the interposer including cavities to at least partially receive the bumps of the die.

7. The apparatus of claim 6, further comprising the flexible tape including slits creating flaps that fold into the cavities of the interposer.

8. The apparatus of claim 7, wherein the slits comprise an x-shaped cross cut creating four flaps.

9. The apparatus of claim 6, further comprising the interposer including bumps to couple with a substrate.

10. The apparatus of claim 6, wherein the interposer comprises plating with one or more metals chosen from the group consisting of: nickel, copper, gold, silver, tungsten, and alloys containing nickel, copper, gold, silver or tungsten.

11. An electronic appliance comprising:
a network controller;
a system memory; and
a processor, wherein the processor comprises: a die including bumps, a flexible tape layer including contact areas coupled with the bumps, a ceramic interposer including cavities to at least partially receive the bumps, and a substrate coupled with the interposer.

12. The electronic appliance of claim 11 , wherein the flexible tape layer comprises polyimide tape having a thickness of 25um.

13. The electronic appliance of claim 11, further comprising the interposer including bumps that are soldered to the substrate.

14. The electronic appliance of claim 11, further comprising a second flexible tape layer that couples the substrate with the interposer.

15. The electronic appliance of claim 11, wherein the flexible tape couples with the interposer through a gold-to-gold bond.

16. An apparatus comprising:
an integrated circuit die;
a substrate;
flexible tape adhering the die to the interposer; and
an interposer coupling the die to the substrate.

17. The apparatus of claim 16, wherein the flexible tape layer comprises a copper-plated polyimide tape with a gold/nickel plated surface finish.

18. The apparatus of claim 16, wherein the interposer comprises ceramic material with cavities that surround bumps on the die pushing down contact points in the flexible tape.

19. The apparatus of claim 16, wherein the flexible tape comprises x-shaped cross cut contact points containing four flaps.

20. The apparatus of claim 16, wherein the flexible tape comprises copper-plated polyimide tape having a thickness selected by restitution.