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1. WO1991006117 - STRUCTURE DE MICROCIRCUIT TRIDIMENSIONNEL ET SON PROCEDE DE FABRICATION A PARTIR D'UNE BANDE CERAMIQUE

Note: Texte fondé sur des processus automatiques de reconnaissance optique de caractères. Seule la version PDF a une valeur juridique

[ EN ]

WE CLAIM:

1. A process for fabricating an electrical circuit structure, comprising the steps of:
(a) providing a substrate;
(b) providing a flexible, thermally fusible sheet having an electrical circuit pattern formed on a surface thereof;
(c) laminating a surface of the sheet opposite to the surface on which the pattern is formed onto the substrate; and
(d) heating the substrate and sheet to a temperature which causes the sheet to fuse to the substrate;
steps (c) and (d) in combination including causing the sheet to bend into a non-planar shape, and thermally fuse to the substrate in the non-planar shape.

2. A process as in claim 1, further comprising the step, performed between steps (a) and (c) , of:
(e) forming an electrical circuit pattern on a surface of the substrate;
steps (c) and (d) comprising laminating and fusing the sheet to the surface of the substrate on which the electrical pattern is formed.

3. A process as in claim 1, in which the substrate provided in step (a) is substantially rigid and has an edge, step (c) comprising bending an edge portion of the sheet over the edge of the substrate, and laminating the edge portion of the sheet to the edge of the substrate.

4. A process as in claim 3, in which step (b) comprises providing the electrical circuit pattern on the edge portion of the surface of the sheet in the form of an electrical edge connector.

5. A process as in claim 3, in which step (c) further comprises bending the edge portion of the sheet around the edge of the substrate, and laminating said bent around edge portion of the sheet to a back surface of the substrat .

6. A process as in claim 1, in which steps (a) and (c) comprise providing each of the substrate and sheet in the form of thermally fusible tape, the process further comprising the step, performed between steps (a) and (c) , of:
(e) forming an electrical circuit pattern on a surface of the substrate;
steps (c) and (d) comprising laminating and fusing the sheet to the surface of the substrate on which the electrical pattern is formed.

7. A process as in claim 6, in which:
step (c) includes laminating the substrate and sheet together to form a substantially planar shape; and
step (d) includes causing a force to be applied to the laminated substrate and sheet which causes the substrate and sheet to plastically deform into the non-planar shape.

8. A process as in claim 7, in which step (d) comprises releasably supporting a first portion of the laminated substrate and sheet, heating the substrate and sheet to said temperature which further causes the tape of the substrate and sheet to become plastic, and allowing an unsupported second portion of the laminated substrate and sheet to be plastically bent downwardly by gravity relative to the first portion.

9. A process as in claim 8, in which step (a) comprises providing each of the substrate and sheet in the form of co-fired, glass-ceramic tape, said temperature being less than substantially 1000°C.

10. A process for forming an electrical circuit structure having an edge connector, comprising the steps of:
(a) providing a substantially rigid substrate having an edge;
(b) providing a sheet of thermally fusible transfer tape having an electrical edge connector pattern formed on an edge portion of a surface thereof;
(c) laminating a surface of the tape opposite to the surface on which the pattern is formed onto the substrate such that the edge portion of the tape is bent over and laminated to the edge of the substrate; and
(d) heating the substrate and tape to a temperature which causes the tape to fuse to the substrate.

11. A process as in claim 10, in which step (c) further comprises bending the edge portion of the tape around the edge of the substrate, and laminating said bent around edge portion of the tape to a back surface of the substrate.

12. A process for fabricating a ceramic tape electrical circuit structure, comprising the steps of:
(a) providing a thermally fusible ceramic tape having an electrical circuit pattern formed on a surface thereof:
(b) heating the tape to a temperature which causes the tape to become temporarily plastic, and causing the tape to be bent into a non-planar shape while plastic; and (c) further heating the tape to a temperature which causes the tape to sinter, and upon cooling, causing the tape to become sintered in the non-planar shape.

13. A process as in claim 12, in which step (b) comprises releasably supporting a first portion of the tape, and allowing an unsupported second portion of the tape to be plastically bent downwardly by gravity relative to the first portion.

14. A process for f bricating a co-fired ceramic tape electrical circuit structure, comprising the steps of:
(a) laminating together a plurality of layers of glass-ceramic tape having electrical circuit patterns formed thereon respectively to form an integral structure;
(b) heating the structure to a temperature which causes the tape to become temporarily plastic, and causing the structure to be bent into a non-planar shape while the tape is plastic; and
(c) further heating the structure to a temperature at which the tape sinters, and causing the tape to become sintered in the non-planar shape.

15. A process as in claim 14, in which step (b) comprises releasably supporting a first portion of the structure, and allowing an unsupported second portion of the structure to be plastically bent downwardly by gravity relative to the first portion.

16. A process as in claim .14, in which step (b) comprises releasably supporting an inner portion of the structure, and allowing unsupported outer portions of the structure to be plastically bent downwardly by gravity relative to the central portion.

17. A process as in claim 14, in which step (b) comprises releasably supporting outer portions of the structure, and allowing an unsupported inner portion of the structure to be plastically bent downwardly by gravity relative to the outer portions.

18. An electrical circuit structure, comprising:
a substrate; and
a sintered ceramic sheet having a non-planar shape, and an electrical circuit pattern formed on a surface thereof;
a surface of the sheet opposite to the surface on which the pattern is formed being thermally fused to the substrate.

19. A structure as in claim 18, in which a surface of the substrate to which the sheet is fused has an electrical circuit pattern formed thereon.

20. A structure as in claim 18, in which the substrate is substantially rigid and has an edge, the sheet having an edge portion which is bent over and thermally fused to the edge of the substrate.

21. A structure as in claim 20, in which the electrical circuit pattern formed on the sheet comprises an electrical edge connector pattern formed on the edge portion thereof.

22. A structure as in claim 20, in which the edge portion of the sheet is further bent around the edge of the substrate and fused to a back surface thereof.

23. A structure as in claim 18, in which the substrate and sheet each comprise thermally fusible tape, and are integrally sintered into the non-planar shape.

24. A structure as in claim 23, in which the thermally fusible tape is glass-ceramic tape.

25. An electrical circuit structure comprising a sintered ceramic sheet which is plastically forme'd from thermally fusible tape into a non-planar shape, and an electrical circuit pattern formed on a surface of the sheet.

26. A structure as in claim 25, in which the thermally fusible tape is glass-ceramic tape.

27. An electrical circuit structure comprising a plurality of sintered ceramic sheets formed from thermally fusible tape, each sheet having an electrical circuit pattern formed on a surface thereof, the sheets being laminated and thermally fused together, and integrally formed into a non-planar shape.

28. A structure as in claim 27, in which thermally fusible tape is glass-ceramic tape.

29. A structure as in claim 27, comprising an edge connector portion which includes a substantially right angle bend, the structure further including an electrical edge connector pattern formed on the outwardly facing surface of the edge connector portion.

30. A process for fabricating a co-fired ceramic tape electrical circuit structure, comprising the steps of:
(a) laminating together a plurality of layers of glass-ceramic tape having electrical circuit patterns formed thereon respectively to form an integral structure;

(b) heating the structure to a temperature which causes the tape to become temporarily plastic, and molding the structure into a non-planar shape while the tape is plastic; and
(c) further heating the structure to a temperature at which the tape sinters, and causing the tape to become sintered in the non-planar shape.