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1. WO1988003919 - PATE DE TUNGSTENE POUR LE FRITTAGE COMBINE AVEC DE L'ALUMINE PURE ET PROCEDE DE PRODUCTION

Note: Texte fondé sur des processus automatiques de reconnaissance optique de caractères. Seule la version PDF a une valeur juridique

[ EN ]

What is claimed is:
1. A process for producing a substrate having a conductive layer, comprising:
(a) obtaining a green tape consisting of
substrate particles yielding a substrate having a sintering temperature ranging between 1450 and 1550° C;
(b) mixing into a paste, of at least one metal selected from the group consisting of tungsten and
molybdenum, a quantity of at least approximately 7% by volume of a glass that within the foregoing sintering temperature ranges wets both the metal and the substrate particles ;
(c) applying the resulting metal-glass paste to a surface of the green tape; and
(d) co-firing the tape with the applied paste.
2. A process according to claim 1, wherein the glass is selected from the group consisting of alkaline earth alumino silicates and aluminates.
3.. A process according to claim 2, wherein the
substrate particles are selected from the group consisting of (i) at least 98% alumina and (ii) alumina-based
composites.
4. A process according to claim 3 , wherein the glass is an alkaline earth alumino silicate.
5. A process according to claim 4, wherein the
substrate particles are at least 98% alumina.
6. A process according to claim 5, wherein the
substrate particles have a narrow size range.
7. A process for producing a ceramic substrate having a conductive layer, comprising:
(a) mixing into a tungsten paste between
approximately 7 to 40 by volume of alkaline earth alumino silicate;
(b) applying a layer of the resulting tungsten and glass paste to a surface of a substrate green tape consisting of at least 98% alumina particles; and
(c) co-firing the tape and paste.
8. A process according to claim 7, wherein the alumina particles have a narrow size range.

9. A process according to claim 8, wherein step (c) consists of co-firing the tape and paste at 1475-1550° C.

10. A process according to claim 8, wherein the paste includes tungsten and no more than 37%
CaO/Al203/Si02.
11. An as-fired substrate-based circuit package, comprising:
a substrate having at least one of (i) a sintering temperature ranging between 1450 and 1550° C and (ii) a post-firing metallization temperature less than 1600° C; and
a conductive layer of at least one metal selected from the group consisting of tungsten and molybdenum and between approximately 5 and 35 volume percent of a glass that wets both the substrate and the selected metal at the foregoing sintering temperature.
12. A package according to claim 11, wherein the glass is selected from the group including alkaline earth alumino silicates and aluminates.
13. A package according to claim 12 , wherein the glass is an alkaline earth alumino silicate.
14. A package according to claim 13 , wherein the substrate is selected from the group consisting of (i) at least 98% alumina, (ii) beryllia, (iii) zirconia, (iv) alumina-based composites, (v) aluminum nitride, and (vi) silicon nitride.
15. A package according to claim 14, wherein the substrate .is at least 98% alumina.
16. An as-fired ceramic-based circuit package,
comprising:
a substrate including at least 98% alumina
particles; and
a conductive layer including tungsten and between approximately 5 and 35 volume percent of
Ca0/Al203/Si02.
17. A circuit package according to claim 16, wherein the alumina particles are characterized by having a narrow size range.
18. A composition, for adhesion to a substrate after
firing, comprising:
(a) at least one refractory metal selected from the group consisting of tungsten and molybdenum;
(b) an alkaline earth alumino silicate.
19. A composition according to claim 18, wherein the alkaline earth alumino silicate constitutes between approximately 7 and 40 volume percent of the composition.

SUBSTITUTE SHEET