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Results 1-10 of 420,025 for Criteria: Office(s):all Language:ES Stemming: true maximize
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TitleCtrPubDate
Int.ClassAppl.NoApplicantInventor
1. WO/2015/029126 FEEDERWO05.03.2015
H05K 13/02
PCT/JP2013/072785FUJI MACHINE MFG. CO., LTD.MURASE Hiroki
Provided is a non-splicing feeder wherein a new carrier tape can be set safely. The feeder comprises a third sprocket (63) which is rotatably disposed in an insertion portion (21d) of a main unit (21), and a fourth sprocket (64) which is rotatably disposed more in a transport direction upstream side of the third sprocket (63). Third engaging projections (63a) which engage engaging holes (901b) are formed, at intervals of a fixed angle each, on the third sprocket (63) across the entire outer periphery, and fourth engaging projections (64a) which engage the engaging holes (901b) are formed on the fourth sprocket (64) across only a portion of the outer periphery.

2. WO/2015/029169 JAVANESE GINGER EXTRACT AND METHOD FOR PRODUCING SAMEWO05.03.2015
A61K 36/906
PCT/JP2013/073043HOSODA SHC INC.KATO, Eishin
Provided is Javanese ginger extract wherein the starting material is Javanese ginger and the desired product is a concentrate (containing solid) obtained from a liquid extract. Treatment by heating or exposure to sunlight is performed during the course of production of the desired product from the starting material. In the peak surface area ratio in high-performance liquid chromatography (HPLC), the peak surface area ratio (D/M ratio) of the phenylbutenoid dimer represented by formula (1) to the monomer represented by formula (2) is 0.6 or greater. The amount of Javanese ginger extract ingested or taken orally can be reduced by increasing the content of phenylbutenoid dimer having NGF-like activity.

3. WO/2015/029216 COMPONENT MOUNTING APPARATUSWO05.03.2015
H05K 13/04
PCT/JP2013/073315FUJI MACHINE MFG. CO.,LTD.KAWAI, Hidetoshi
A component disposal conveyor (20) is installed above an installation space for a feeder (12) of a component mounting apparatus such that the space above a component suction position of the feeder (12) is open. One end (a component disposal position) of the component disposal conveyor (20) is located near the component suction position of the feeder (12), and the other end (a component recovery position) of the component disposal conveyor (20) protrudes to the outside of a front cover (11) of the component mounting apparatus. When a component that is suctioned to a suction nozzle (14) is not mountable, the component is placed at the component disposal position of the component disposal conveyor (20) and the component is gradually transported by the component disposal conveyor (20) to the component recovery position outside the component mounting apparatus. The component disposal conveyor (20) also functions as a cover that prevents the feeder (12) from floating above a feeder setting base.

4. WO/2015/029240 SLIDE FASTENER MANUFACTURING DEVICEWO05.03.2015
A44B 19/60
PCT/JP2013/073428YKK CORPORATIONTAKIYAMA Hironori
This slide fastener manufacturing device (10) comprises: a space-forming mechanism (100) that forms a space (14); an end-welding mechanism (200) that forms a welded part (15) in an upstream-side end of a fastener element row (13) that is on the downstream side of the space (14); a lower-stop attachment mechanism (300) that attaches a lower stop (16) to a downstream-side end of the fastener element row (13); a slider attachment mechanism (400) that attaches a slider (17) to the fastener element row (13); an upper-stop attachment mechanism (500) that attaches an upper stop (18) to the upstream-side end of the fastener element row (13); a cutting mechanism (600) that cuts a continuous fastener chain (11) into a predetermined length; and a carry-out mechanism (700) that carries out a slide fastener (19). The continuous fastener chain (11) is transported such that the upper and lower surfaces thereof are inverted between the end-welding mechanism (200) and the lower-stop attachment mechanism (300), and is also transported such that the upper and lower surfaces thereof are inverted between the slider attachment mechanism (400) or the upper-stop attachment mechanism (500) and the cutting mechanism (600) while being changed from a transport path (33) to a transport path (34).

5. WO/2015/029255 INFORMATION CONTROL DEVICE, MOUNTING SYSTEM, AND INFORMATION CONTROL METHODWO05.03.2015
H05K 13/00
PCT/JP2013/073559FUJI MACHINE MFG. CO., LTD.NAKAYAMA, Daisuke
A mounting system (10) generates correspondence relationship information in which measurement information (a solder measurement value) relating to printing inspection processing by a printing inspection device (13), measurement information (a part measurement value) relating to mounting inspection processing by a mounting inspection device (15), and result information (an inspection result) relating to reflow inspection processing by a reflow inspection device (17) are associated. The mounting system (10) then sets a printing determination criterion for the printing inspection processing and a mounting determination criterion for the mounting inspection processing on the basis of the generated correspondence relationship information, and executes the printing inspection processing and the mounting inspection processing using the set printing determination criterion and mounting determination criterion. For example, the state of soldering, the state of disposition of a part, and the like are mutually related to a final state after reflow in some cases. The mounting system sets the determination criterions on the basis of the mutually related corresponding relationship information.

6. WO/2015/029235 ANTENNA DEVICEWO05.03.2015
H01Q 9/38
PCT/JP2013/073404FUJITSU LIMITEDKOGA, Yohei
This antenna device has: a grounding electrode; a first dielectric layer that is provided on one surface of the grounding electrode; a power supply plate, which is provided on a first dielectric layer surface on the reverse side of the grounding electrode, and which is short-circuited with the grounding electrode; a power supply line that supplies power to the power supply plate; a second dielectric layer that is provided to sandwich the power supply plate with the first dielectric layer; and a radiation electrode, which is provided on a second dielectric layer surface on the reverse side of the power supply plate, and which is supplied with power by being electrically connected to the power supply plate at a power supply point, said radiation electrode radiating or receiving radio waves at a first frequency.

7. WO/2015/029104 VERTICALLY INTEGRATED SYSTEM AND FIRMWARE UPDATE METHODWO05.03.2015
G06F 11/00
PCT/JP2013/072713HITACHI, LTD.KATSURA, Naohiro
[Problem] Proposed is a vertically integrated system and firmware update method which can make firmware updates easier and lessen the burden on a manager. [Solution] Provided is a vertically integrated system provided with a computer, a storage device, a connection device, and a management computer, wherein the vertically integrated system is characterized by the following: for the firmware version of each of the computer, storage device, and connection device, the management computer stores in memory and manages information indicating combinations of the firmware versions for which the operation thereof is guaranteed, as the firmware version for the vertically integrated system; and if the firmware of each of the computer, storage device, and connection device are to be updated, the management computer updates the firmware of each of the computer, storage device, and connection device all at once on the basis of the firmware version for the vertically integrated system.

8. WO/2015/029108 SOIL REMOVAL DEVICE AND REMOVAL METHODWO05.03.2015
B08B 1/02
PCT/JP2013/072725FUJI SHOJI CO.,LTD.GOTO Katsuhiro
Provided are a soil removal device (10) and a removal method for removing soil, such as scale residue, smut, or the like, from the surface of a wire material (11) by a cord-shaped member (12), without the use of chemicals or ultrasonic waves. This soil removal device (10) is characterized by having: a wire material winding means (28) for winding a wire material (11) on the surface of which soil such as scale residue, smut, or the like is deposited; a cord-shaped member (12) for wrapping about the wire material (11), and wiping away soil on the surface of a wire material (11) through relative sliding with respect to the wire material (11); and a cord-shaped member feed means (13) for feeding the cord-shaped member (12) with respect to the wire material (11). The soil removal method is characterized by linear feed of a wire material (11) on the surface of which soil such as scale residue, smut, or the like is deposited, wrapping a cord-shaped member (12) about the wire material (11), and winding the cord-shaped member (12), to thereby wipe away soil on the surface of a wire material (11), as well as jetting air onto the surface of the wire material (11) to blow away soil remaining on the surface of the wire material (11).

9. WO/2015/029262 METHOD FOR MANUFACTURING OPTICAL MEMBER, OPTICAL MEMBER, TRANSPARENT MEMBER FOR FORMING OPTICAL MEMBER, OPTICAL WAVEGUIDE, AND OPTICAL MODULEWO05.03.2015
G02B 1/12
PCT/JP2013/074009HITACHI CHEMICAL COMPANY, LTD.SAKAI, Daichi
The present invention provides a method for manufacturing an optical member that can positionally control with high precision the index of refraction of the proximity and center part of a site for a surface layer of a core pattern for a transparent member and also provides an optical waveguide with low optical loss. This method for manufacturing an optical member has a Step A wherein the transparent member is exposed to a solution and the index of refraction of a surface layer site on the transparent member that is exposed to the solution is made substantially lower than the index of refraction of the center part of the transparent member that is not exposed to the solution. The substantial lowering of the index of refraction of the surface layer site can be achieved by expressing the function of an index of refraction controlling agent included at the surface layer site of the transparent member. In addition, this optical waveguide mainly has a surface layer site in which the periphery on two or more sides of the core pattern that forms a core part has an index of refraction lower than the center part of the core pattern. The surface layer site includes the index of refraction controlling agent for lowering the index of refraction, and further, has a lower cladding layer and/or an upper cladding layer with a lower index of refraction outside the surface site having the low index of refraction.

10. WO/2015/029141 LASER OSCILLATORWO05.03.2015
H01S 3/10
PCT/JP2013/072906MITSUBISHI ELECTRIC CORPORATIONSUZUKI, Hiroyuki
A laser oscillator is provided with: a laser light source which outputs first laser light; a wavelength conversion unit which converts the wavelength of the first laser light to output second laser light with a pulse energy of 500 μJ or more; and an optical component which is disposed on the side behind the wavelength conversion unit of an optical path, and propagates the second laser light obtained by converting the wavelength by the wavelength conversion unit, and a distance is put between the wavelength conversion unit and the optical component such that the energy density of the second laser light incident on the optical component becomes 30 mJ/cm2 or less.


Results 1-10 of 420,025 for Criteria: Office(s):all Language:ES Stemming: true
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