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1. (WO2019046468) RIGID CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
Nota: Texto obtenido mediante procedimiento automático de reconocimiento óptico de caracteres.
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CLAIMS

What is claimed is:

1 . A carrier tray assembly comprising:

a rigid tray that includes

a deck area having a substantially flat surface for receiving semiconductor components, and

a rim that extends around at least a portion of a periphery of the deck area;

an adhesive film affixed to the substantially flat surface of the deck area,

wherein the adhesive film includes a tacky upper surface for securing the semiconductor components to the deck area.

2. The carrier tray assembly of claim 1 , wherein the rigid tray is formed as a single component during an injection molding process.

3. The carrier tray assembly of claim 1 , wherein the rigid tray is comprised of polyethylene thermoplastic.

4. The carrier tray assembly of claim 1 , wherein the adhesive film is laminated to the substantially continuous surface of the deck area as a single continuous sheet during a lamination process.

5. The carrier tray assembly of claim 1 , wherein the adhesive film aids in the securement of the semiconductor components to the deck area in a predetermined arrangement that enables the semiconductor components to be separately pulled away from the adhesive film.

6. The carrier tray assembly of claim 5, wherein the carrier assembly is designed such that electrical current is able to flow from the rigid tray to an electrical ground.

7. The carrier tray assembly of claim 1 , wherein the adhesive film is comprised of a polymer-based material.

8. The carrier tray assembly of claim 1 , wherein a height of the rim is based on a thickness of the semiconductor components.

9. The carrier tray assembly of claim 1 , further comprising:

a carrier component extending outward from the rim of the rigid tray.

10. The carrier tray assembly of claim 1 , further comprising:

an interlock component arranged along a top surface of the rim,

wherein the interlock component is designed to engage a corresponding interlock component arranged along a bottom surface of an upwardly adjacent carrier tray assembly.

1 1 . A method for transporting a semiconductor component, the method comprising: acquiring a rigid carrier tray that includes a deck area on which semiconductor components are to be secured;

securing an adhesive film to at least a portion of the deck area as a single

continuous sheet,

wherein the adhesive film comprises a tacky upper surface; and adhering a semiconductor component to the tacky upper surface of the adhesive film.

12. The method of claim 1 1 , further comprising:

forming a cavity for receiving a protruding feature of the semiconductor

component into a top surface of the deck area.

13. The method of claim 12, wherein said adhering comprises:

engaging the protruding feature of the semiconductor component and the cavity of the rigid carrier tray.

14. The method of claim 13, wherein said engaging causes the protruding feature of the semiconductor component to puncture the adhesive film.

15. The method of claim 1 1 , wherein the adhesive film comprises multiple adhesive sheets.

16. The method of claim 15, wherein the adhesive sheets are interconnected such that electrical current is able to flow between the adhesive sheets.

17. The method of claim 1 1 , wherein the adhesive film comprises a depression to receive the semiconductor component.

18. The method of claim 1 1 , wherein the semiconductor component is one of multiple semiconductor components that are adhered to the tacky upper surface of the adhesive film, and wherein the multiple semiconductor components are arranged in a predetermined pattern.

19. An apparatus for housing semiconductor components, the apparatus comprising: at least two carrier tray assemblies configured to transport semiconductor

components, each carrier tray assembly of the at least two carrier tray assemblies including:

a rigid tray having a substantially flat deck area,

an adhesive film affixed to the substantially flat deck area,

wherein the adhesive film includes a tacky upper surface for

securing the semiconductor components to the rigid tray, a first interlock component arranged along a top surface of the rigid tray, wherein the first interlock component is configured to engage a corresponding interlock component on an upwardly adjacent carrier tray assembly, and

a second interlock component arranged along a bottom surface of the rigid tray,

wherein the second interlock component is configured to engage a corresponding interlock component on a downwardly adjacent carrier tray assembly.

20. The apparatus of claim 19, wherein the at least two carrier tray assemblies are vertically interlocked with one another.