Colecciones nacionales e internacionales de patentes

1. (WO2018051870) THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF

Pub. No.:    WO/2018/051870    International Application No.:    PCT/JP2017/032206
Publication Date: Fri Mar 23 00:59:59 CET 2018 International Filing Date: Fri Sep 08 01:59:59 CEST 2017
IPC: C08L 33/12
C08L 33/14
Applicants: SUMITOMO CHEMICAL COMPANY, LIMITED
住友化学株式会社
Inventors: KONISHI, Shota
小西 翔太
Title: THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF
Abstract:
A thermoplastic resin composition comprising: 100 parts by mass of a methacrylic polymer (A) containing 85-100 mass% of a monomeric unit derived from methyl methacrylate; 0.1-100 parts by mass of an epoxy group-containing polymer (B) containing 1-50 mass% of a monomeric unit derived from a (meth)acrylic acid ester having an epoxy group, and 50-99 mass% of a monomeric unit derived from at least one monomer selected from the group consisting of ethylene, α-olefins having three or more carbon atoms, and styrene; and 0.01-25 parts by mass of crosslinked rubber particles (C) containing a resin having a polyfunctional monomeric unit derived from a polyfunctional monomer having two or more carbon-carbon double bonds and a monomeric unit derived from at least one monomer selected from the group consisting of (meth)acrylic acid alkyl esters, butadiene, isoprene, chloroprene, styrene, α-alkylstyrene, acrylonitrile, and methacrylonitrile.