Colecciones nacionales e internacionales de patentes

1. (WO2014203872) MOLD RELEASE FILM

Pub. No.:    WO/2014/203872    International Application No.:    PCT/JP2014/065957
Publication Date: Thu Dec 25 00:59:59 CET 2014 International Filing Date: Wed Jun 18 01:59:59 CEST 2014
IPC: H01L 21/56
B29C 33/68
Applicants: SEKISUI CHEMICAL CO., LTD.
積水化学工業株式会社
Inventors: UTO Kouhei
宇都 航平
Title: MOLD RELEASE FILM
Abstract:
The present invention provides a mold release film which exhibits excellent mold releasability and is capable of suppressing appearance defects of a product by suppressing flow-out of a resin even under high-temperature molding conditions. The present invention is a mold release film which comprises: a supporting layer having a single layer structure or multilayer structure that includes at least one layer which contains a polybutylene terephthalate resin; and a mold release layer.