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1 / 465,855
1.WO/2000/046032INK-JET RECORDING APPARATUS CAPABLE OF LIMITEDLY USING ONLY GENUINE INK CARTRIDGE, INK CARTRIDGE USABLE IN THE SAME, AND INK REFILLING MEMBER
WO - 10.08.2000
Int.Class B41J 2/175
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005characterised by bringing liquid or particles selectively into contact with a printing material
01Ink jet
17characterised by ink handling
175Ink supply systems
 Appl.No PCT/JP2000/000538 Applicant CASIO COMPUTER CO., LTD. Inventor KOBAYASHI, Kenji
Three ink storage chambers (68) stored into a main body case of an ink cartridge (44) are isolated from four surfaces of this main case body by way of a partition (66) and depressing partition portions projected from this portion (76). Also, these ink storage chambers are isolated from a bottom portion of the main body case by a stepped portion (79) of a lower cylindrical portion (77), and are arranged by forming space between a lid and the own ink chambers. Only refilling hole portions of an upper cylindrical portion are communicated with an external portion via holes of the lid. A label on which a trademark 'ABC' is printed is attached onto the upper portions of the three refilling hole portions (72). A label reading apparatus (31) is provided on the side of an ink-jet printer, and a printing operation by any ink cartridge other than the genuine-labeled ink cartridge is not carried out. As a genuine ink refilling member, at least ink bottles and a label are employed as a set of such a genuine ink refilling member. The ink cannot be refilled via a hole formed in any portion of an ink cartridge, except for the refilling hole portion.
2.WO/2000/073077INK-JET PRINTER HEAD AND MANUFACTURING METHOD THEREOF
WO - 07.12.2000
Int.Class B41J 2/14
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005characterised by bringing liquid or particles selectively into contact with a printing material
01Ink jet
135Nozzles
14Structure thereof
 Appl.No PCT/JP2000/003280 Applicant CASIO COMPUTER CO., LTD. Inventor KAMADA, Hideki
Each of heating elements comprises a heating resistor (24), and a pair of a common electrode (21) and an individual electrode (23) formed on ends of said heating resistor (24) so that a heating area (25) of the heating resistor (24) is exposed. A barrier layer (41) covers the electrodes (21, 23) so that the electrodes are not exposed to the ink in the ink flow passage, that is, not only upper surface of the electrodes (21, 23), but also edges thereof are covered with the barrier layer (41). The barrier layer (41) is made of, for example, single atomic metal such as Ta and Ti, oxide, corrosion resistant amorphous alloy, titanium nitride, titanium-tungsten, or the like. The barrier layer (41) has the thickness of 10 to 1,000 nm, and is made by electroless plating or the like. The barrier layer (41) is effective in preventing not only corrosion but also migration as contact surface corrosion.
3.WO/1994/015034HIGH R SUPER INSULATION PANEL
WO - 07.07.1994
Int.Class C03B 37/15
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
BMANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL; SUPPLEMENTARY PROCESSES IN THE MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL
37Manufacture or treatment of flakes, fibres, or filaments from softened glass, minerals, or slags
10Non-chemical treatment
14Re-forming fibres or filaments
15with heat application, e.g. for making optical fibres
 Appl.No PCT/US1993/012536 Applicant OWENS-CORNING FIBERGLAS CORPORATION Inventor RUSEK, Stanley, J.
An insulation panel (18) comprises an insulation board (10) of glass fibers and a partially evacuated gas-tight envelope (20) encapsulating the board (10), where, prior to the evacuation of the envelope (20), the board (10) has been subjected to a heat setting process in which the board (10) is raised to a heat setting temperature above the strain temperature of the glass but below the softening temperature of the glass and to a pressure applied by opposed platens (12, 14) followed by a quick release of the board (10) from the platens (12, 14) prior to substantial cooling of the board (10).
4.WO/2004/017404USE OF METAL OXIDE MASKS FOR TREATING SURFACES IN THE PRODUCTION OF MICROCHIPS
WO - 26.02.2004
Int.Class H01L 21/311
HELECTRICITY
01ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H1060
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
31to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
3105After-treatment
311Etching the insulating layers
 Appl.No PCT/DE2003/002378 Applicant INFINEON TECHNOLOGIES AG Inventor JAKSCHIK, Stefan
The invention relates to a method for modifying a semiconductor section by section. For doping purposes, the sections that for example are to remain undoped, are masked by a metal oxide, e.g. aluminium oxide (6). The semiconductor is subsequently doped, e.g. from a gas phase, in those sections (7) that have not been covered by the aluminium oxide. The aluminium oxide is then selectively removed, for example using hot phosphoric acid, thus leaving sections of the semiconductor surface consisting of silicon, silicon oxide or silicon nitride on the wafer.
5.WO/2003/017331MEMORY CELL WITH A TRENCH CAPACITOR AND VERTICAL SELECTION TRANSISTOR AND ANNULAR CONTACTING AREA FORMED BETWEEN THEM
WO - 27.02.2003
Int.Class H01L 21/8242
HELECTRICITY
01ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H1060
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
78with subsequent division of the substrate into plural individual devices
82to produce devices, e.g. integrated circuits, each consisting of a plurality of components
822the substrate being a semiconductor, using silicon technology
8232Field-effect technology
8234MIS technology
8239Memory structures
8242Dynamic random access memory structures (DRAM)
 Appl.No PCT/DE2002/002559 Applicant INFINEON TECHNOLOGIES AG Inventor BIRNER, Albert
The top capacitor electrode (10) of the trench capacitor is connected to an epitactically grown source/drain area (21) of the selection transistor (20) by an annular, monocrystalline Si contacting area (7.1). The gate electrode layer (24) has an oval peripheral course around the transistor (20), wherein the oval peripheral courses of the gate electrode layers (24) form overlapping areas (24.3) of memory cells placed in rows next to one another along a word line in order to enhance packing density.
6.WO/2002/058070SELECTION DEVICE FOR A SEMICONDUCTOR MEMORY DEVICE
WO - 25.07.2002
Int.Class G11C 11/16
GPHYSICS
11INFORMATION STORAGE
CSTATIC STORES
11Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
02using magnetic elements
16using elements in which the storage effect is based on magnetic spin effect
 Appl.No PCT/DE2002/000141 Applicant INFINEON TECHNOLOGIES AG Inventor VIEHMANN, Hans-Heinrich
The invention relates to a selection device for a semiconductor memory device. The aim of the invention is to prevent voltage drops caused by read currents in a column multiplexer (10) of a semiconductor memory device (1). To this end, the switch devices (12) of the selection device (10) comprise two switch elements (T1, T2). The invention is further characterized in that associated bit lines (4) can be interlinked with a potential sampling connection (22) or a current feed connection (24) of a respective associated sense amplifier (20) by means of the first and the second switch element (T1, T2).
7.WO/2004/006011METHOD AND ARRANGEMENT FOR THE MANIPULATION OF RETICLES
WO - 15.01.2004
Int.Class G03F 7/20
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
 Appl.No PCT/DE2003/002108 Applicant INFINEON TECHNOLOGIES AG Inventor SCHEDEL, Thorsten
The invention relates to an arrangement for the depositing or withdrawing of reticles, provided with a magazine housing in which an withdrawing and depositing magazine may be inserted, which has at least one horizontal housing compartment for housing a reticle, a manipulator and a drive unit for moving the reticle magazine and/or the manipulator relative to each other. The invention further relates to a method for the withdrawing or depositing of reticles in photolithographic processes, whereby reticles provided with pellicles are moved from a housing compartment in the withdrawing and depositing magazine after insertion of an withdrawing and depositing magazine in a magazine housing, by means of a manipulator from a housing compartment in the withdrawing and deposition magazine and supplied to the lithographic process. The aim of the invention is to prevent reticles, pellicles arranged thereon or magazines to lie outside the determined tolerance range of the manipulation region of the manipulator and thus prevent damage thereto or destruction thereof, at least for the reticle, on application to the photolithographic process. The above is achieved, whereby a corresponding sensor is provided for the reticle, at least indirectly connected to the drive unit for control thereof, from which data relevant to the reticle may be obtained and by means of which data the movement of the manipulator is controlled.
8.WO/2000/046030METHOD OF MANUFACTURING INK-JET PRINTER HEAD
WO - 10.08.2000
Int.Class B41J 2/16
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005characterised by bringing liquid or particles selectively into contact with a printing material
01Ink jet
135Nozzles
16Production of nozzles
 Appl.No PCT/JP2000/000499 Applicant CASIO COMPUTER CO., LTD. Inventor KAMINISHI, Katsuzo
In a method of manufacturing an ink-jet printer which uses a thin film sheet having adhesive layers respectively formed on the top and bottom sides, as an orifice plate, orifices are formed in the ink-ejecting side of the thin film sheet after the adhesive layer on that ink-ejecting side has been removed. This prevents the formation of the orifices from being adversely affected by any otherwise residual of the adhesive layer and can thus permit accurate formation of orifices of a desired shape. Even if helicon-wave dry etching which ensure fast etching using high-power energy is used to form orifices, therefore, no adhesive layer is thermally expanded to be a residual so that multiple orifices can be formed simultaneously and quickly.
9.WO/2001/065671LINEAR MOTOR
WO - 07.09.2001
Int.Class H02K 41/03
HELECTRICITY
02GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
KDYNAMO-ELECTRIC MACHINES
41Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
02Linear motors; Sectional motors
03Synchronous motors; Motors moving step by step; Reluctance motors
 Appl.No PCT/JP2001/001533 Applicant SHINANO ELECTRONICS CO., LTD. Inventor ITOH, Masato
A two-phase flat linear motor of high speed, high thrust and high efficiency used for IC handlers or the like is disclosed. A platen (50) is a laminated body in which a plurality of magnetic thin sheets (T) are laminated in the X-axis direction. Pole teeth (KAX, KA'X, KBX, KB'X) of an X-axis mover (60X) are arranged flat in the Y-axis direction with equal spatial phases with respect to a closest dot (D) in the Y-axis direction, while they are repetitively arranged every one dot pitch in the X-axis direction. The pole teeth contained within one pitch are so staggered that the with spatial phases with respect to a closest dot (D) in the X-axis direction are mutually different by 1/4 pitch. With this staggered arrangement, the X-axis mover (60X) can move in X-axis direction. Consequently, the laminated body of the magnetic thin plates can be utilized as a platen.
10.WO/2003/038829STORAGE ASSEMBLY
WO - 08.05.2003
Int.Class G11C 5/14
GPHYSICS
11INFORMATION STORAGE
CSTATIC STORES
5Details of stores covered by group G11C11/63
14Power supply arrangements
 Appl.No PCT/DE2002/003812 Applicant INFINEON TECHNOLOGIES AG Inventor BANGERT, Joachim
The invention relates to a storage assembly comprising an energy store (E2 E5), which accumulates energy transported during the flow of a write or read current and provides this energy for a new write or read process.
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