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Analysis

1 / 459,099
1.WO/2003/020433COATING DEVICE FOR PROCESSING A LIQUID INTO FINE MIST AND SPRAYING THE FINE MIST TOWARDS A WORKPIECE
WO - 13.03.2003
Int.Class B05B 7/00
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
7Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
 Appl.No PCT/JP2002/008565 Applicant JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED Inventor KINOSHITA, Hiromichi
In a coating device using mist-blowing technique, a primary spray (3) injects a liquid tp produce original mist. Supplied with the original mist, a mist box (2) produces a fine mist having a very small particle size. A secondary spray (5) is connected to the mist box and sprays the fine mist towards a workpiece.
2.WO/2002/046775CONDUCTIVE CONTACT SHOE
WO - 13.06.2002
Int.Class G01R 1/067
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
 Appl.No PCT/JP2001/010632 Applicant NHK SPRING CO.,LTD. Inventor YAMADA, Yoshio
A holder storing a conductive needle-like body energized outward by a coil so as to allow a movement in longitudinal direction, comprising an inorganic insulator facing an inspected object and an intermediate insulator formed of an insulating resin, wherein the inorganic insulator prevents the conductive needle-like body from being extracted and is formed of a first plate of insulating inorganic facing the inspected object and a second plate of the insulating resin stuck to each other.
3.WO/2002/019052METHOD AND APPARATUS FOR GENERATING MEASUREMENT DATA
WO - 07.03.2002
Int.Class G01V 1/00
GPHYSICS
01MEASURING; TESTING
VGEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
1Seismology; Seismic or acoustic prospecting or detecting
 Appl.No PCT/JP2001/007229 Applicant TOSHIBA ENGINEERING CORPORATION Inventor OHGAWARA, Takashi
In a system for observing the ground based on various data items measured at one or more observation points by at least one measuring instrument (1), the measured data items are collected (5) in a collection center, it is determined (6) whether at least one of the measured data items is abnormal based on expert knowledge, a re-measurement instruction is given (6a) to the measuring instrument in a case where at least one of the measured data items is abnormal, and the measured data items are edited according to contract conditions for each user to generate (7 to 10) measurement data for users in a case where it is determines that the measuring instrument does not malfunction as a result of re-measurement. Thus, the measurement data satisfying users' demands can be generated with good quality and high reliability, based on the measurement data items obtained at one or more observation points.
4.WO/2002/060797SHEET PROCESSOR AND METHOD OF OPENING AND CLOSING SHEET FEED ROUTE OF THE SHEET PROCESSOR
WO - 08.08.2002
Int.Class B65H 29/22
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
29Delivering or advancing articles from machines; Advancing articles to or into piles
20by contact with rotating friction members, e.g. rollers, brushes, or cylinders
22and introducing into a pile
 Appl.No PCT/JP2002/000775 Applicant NIPPON CONLUX CO., LTD. Inventor ITO, Yukio
A sheet processor, wherein an accumulating mechanism (11) for performing the operation to accumulate bills (P) on a storably accumulating part (20) and a shutter (10) for performing the operation to open and close a bill feed route (4) share a common drive means (M2) with one another, whereby the number of parts and the cost of the entire device can be reduced.
5.WO/2003/007653SPEAKER DEVICE
WO - 23.01.2003
Int.Class H04R 5/02
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
5Stereophonic arrangements
02Spatial or constructional arrangements of loudspeakers
 Appl.No PCT/JP2002/006957 Applicant SONY CORPORATION Inventor SEKI, Hideki
In order to obtain a speaker device in which the localization point of a sound source is located at a distant place, providing a feeling of expanse (deepness) without involving an oppressive feeling due to sound pressure, and a good operability that makes it possible to reproduce sounds with frequency characteristics covering the high frequency range, and to achieve size reduction, there is provided a speaker device designed so that the sounds from speakers (2L, 2R) are emitted obliquely rearward to be reflected by reflection plates (8L, 8R) pivotally mounted on the back plates (7L, 7R) of a speaker cabinet (1L, 1R), the reflected sounds being directed to the audience.
6.WO/2004/079112PLANE TRUSS AND SPACE TRUSS, ROOF STRUCTURE USING THESE TRUSSES, AND METHOD OF MANUFACTURING SPACE TRUSS
WO - 16.09.2004
Int.Class E04C 3/04
EFIXED CONSTRUCTIONS
04BUILDING
CSTRUCTURAL ELEMENTS; BUILDING MATERIALS
3Structural elongated elements designed for load-supporting
02Joists; Girders, trusses, or truss-like structures, e.g. prefabricated; Lintels; Transoms
04of metal
 Appl.No PCT/JP2003/002622 Applicant JFE ENGINEERING CORPORATION Inventor IIDA, Yasuhiko
A plane truss and a space truss capable of being accurately and easily manufactured in reasonable structures without overlapping members, a roof structure using these trusses, and a method of manufacturing the space truss, the plane truss wherein top chords and bottom chords are disposed on a same straight line and the upper sides of the top chords, at least one sides of the bottom chords are disposed parallel with each other, strut materials and diagonal braces are connected therebetween, and angles formed by one sides of the top chords and one sides of the top chords adjacent to the top chords are equal to angles formed by one sides of the bottom chords; the method of manufacturing the space truss comprising the steps of jointing the top chords or the bottom chords of two plane trusses to each other to form V- trusses, disposing a plurality of V-trusses, and jointing the top chords or bottom chords of the adjacent V-trusses to each other.
7.WO/2004/031512METHOD FOR EXTENDING STAIRCASE TYPE APARTMENT HOUSE AND BUILDING EXTENDED USING THAT METHOD
WO - 15.04.2004
Int.Class E04G 23/02
EFIXED CONSTRUCTIONS
04BUILDING
GSCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
23Working measures on existing buildings
02Repairing, e.g. filling cracks; Restoring; Altering; Enlarging
 Appl.No PCT/JP2002/013457 Applicant KABUSHIKI KAISHA MIRACLE THREE CORPORATION Inventor KOKAWA, Norifumi
In a staircase type apartment house provided, between adjacent dwelling units (1), with an outdoor staircase (3) for connection with the doorway (2) of each dwelling unit, a foundation part for extension is provided on the outerside of the existing foundation part of the staircase type apartment house, and a supporting member (4) is stood on the foundation part for extension. A roof (5) for extension is then provided at the top part of the supporting member above the existing roof of the staircase type apartment house and a floor member (6) being supported at the middle of the supporting member is provided above the existing roof in order to form a new living space (7) between the floor member and the roof for extension. Subsequently, a passage (11) facing all adjacent dwelling units and interconnecting respective dwelling units is provided, and after an elevator (12) and a staircase (13) are installed at positions facing the passage, a new floor (9) is extended at the same height as the floor height of each floor on the outdoor staircase side or the opposite side and an entrance (10) facing the passage is provided for each adjacent dwelling unit independently.
8.WO/2004/001838PACKAGING OF A MICROCHIP DEVICE-I
WO - 31.12.2003
Int.Class B29C 45/00
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
45Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
 Appl.No PCT/SG2002/000124 Applicant WANG, Chuen, Khiang Inventor WANG, Chuen, Khiang
A method of packaging a microchip device, an interposer for packaging, and a packaged microchip device. An interposer (7) is placed on microchip devices (1). The interposer (7) comprises an aperture (11) which extends from the interposer surface where external electrical contacts (9) are located to the surface of the microchip devices (1). Electrical contacts (3) on the microchip devices surface are accessible through the aperture (11) in order to electrically connect the electrical contacts (3) with the external electrical contacts (9) of the interposer (7). The interposer (7) comprises separate openings or aperture regions, in particular separated by a bridge (19), which extend from the interposer surface where the external contacts (9) are located into the interposer (7). This facilitates the handling of the finalised package and allows for satisfactory filling of the aperture (11) with filling material.
9.WO/2004/002003PACKAGING OF A MICROCHIP DEVICE
WO - 31.12.2003
Int.Class H01L 21/56
HELECTRICITY
01ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H1060
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18-H01L21/326 or H10D48/04-H10D48/07218
56Encapsulations, e.g. encapsulating layers, coatings
 Appl.No PCT/SG2002/000125 Applicant WANG, Chuen, Khiang Inventor WANG, Chuen, Khiang
A method of packaging a microchip device, an interposer for packaging, and a packaged microchip device. An interposer (7) is placed on microchip devices (1). The interposer (7) comprises an aperture (11) which extends from the interposer surface where external electrical contacts (9) are located to the surface of the microchip devices (1). Electrical contacts (3) on the microchip device surface are accessible thorough the aperture (11) in order to electrically connect the electrical contacts (3) with the external electrical contacts (9) of the interposer (7). The aperture (11) is divided into at least two openings or aperture regions, separated by a bridge (18). This facilitates the handling of the interposer (7).
10.WO/2002/067624HEAD PHONE DEVICE
WO - 29.08.2002
Int.Class H04R 5/033
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
5Stereophonic arrangements
033Headphones for stereophonic communication
 Appl.No PCT/JP2002/001478 Applicant SONY CORPORATION Inventor ITO, Tomohiro
A head phone device, comprising a band (51) formed of an elastic body for connecting right and left cabinets to each other having a driver directly or indirectly fitted thereto and a tube (30) for covering the band, each cabinet (12) further comprising a through hole (12b) for inserting the band and tube therein and a fixed member (13) inserted into the end part (31) of the tube inserted into the through hole to press the end part of the band against the through hole with a simple structure so that the end part of the tube covering the band is not exposed, wherein the tube (30) covering the band is formed such that the internal space thereof is divided into two spaces (30b, 30c) in longitudinal direction so that, when a cable for transmitting audio signals is passed through the tube covering the band, the cable is not wound on the band.
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