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1 / 513,711
1.WO/2000/046032INK-JET RECORDING APPARATUS CAPABLE OF LIMITEDLY USING ONLY GENUINE INK CARTRIDGE, INK CARTRIDGE USABLE IN THE SAME, AND INK REFILLING MEMBER
WO - 10.08.2000
Int.Class B41J 2/175
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005characterised by bringing liquid or particles selectively into contact with a printing material
01Ink jet
17characterised by ink handling
175Ink supply systems
 Appl.No PCT/JP2000/000538 Applicant CASIO COMPUTER CO., LTD. Inventor KOBAYASHI, Kenji
Three ink storage chambers (68) stored into a main body case of an ink cartridge (44) are isolated from four surfaces of this main case body by way of a partition (66) and depressing partition portions projected from this portion (76). Also, these ink storage chambers are isolated from a bottom portion of the main body case by a stepped portion (79) of a lower cylindrical portion (77), and are arranged by forming space between a lid and the own ink chambers. Only refilling hole portions of an upper cylindrical portion are communicated with an external portion via holes of the lid. A label on which a trademark 'ABC' is printed is attached onto the upper portions of the three refilling hole portions (72). A label reading apparatus (31) is provided on the side of an ink-jet printer, and a printing operation by any ink cartridge other than the genuine-labeled ink cartridge is not carried out. As a genuine ink refilling member, at least ink bottles and a label are employed as a set of such a genuine ink refilling member. The ink cannot be refilled via a hole formed in any portion of an ink cartridge, except for the refilling hole portion.
2.WO/2000/073077INK-JET PRINTER HEAD AND MANUFACTURING METHOD THEREOF
WO - 07.12.2000
Int.Class B41J 2/14
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005characterised by bringing liquid or particles selectively into contact with a printing material
01Ink jet
135Nozzles
14Structure thereof
 Appl.No PCT/JP2000/003280 Applicant CASIO COMPUTER CO., LTD. Inventor KAMADA, Hideki
Each of heating elements comprises a heating resistor (24), and a pair of a common electrode (21) and an individual electrode (23) formed on ends of said heating resistor (24) so that a heating area (25) of the heating resistor (24) is exposed. A barrier layer (41) covers the electrodes (21, 23) so that the electrodes are not exposed to the ink in the ink flow passage, that is, not only upper surface of the electrodes (21, 23), but also edges thereof are covered with the barrier layer (41). The barrier layer (41) is made of, for example, single atomic metal such as Ta and Ti, oxide, corrosion resistant amorphous alloy, titanium nitride, titanium-tungsten, or the like. The barrier layer (41) has the thickness of 10 to 1,000 nm, and is made by electroless plating or the like. The barrier layer (41) is effective in preventing not only corrosion but also migration as contact surface corrosion.
3.WO/2004/017404USE OF METAL OXIDE MASKS FOR TREATING SURFACES IN THE PRODUCTION OF MICROCHIPS
WO - 26.02.2004
Int.Class H01L 21/311
HELECTRICITY
01ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H1060
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
31to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
3105After-treatment
311Etching the insulating layers
 Appl.No PCT/DE2003/002378 Applicant INFINEON TECHNOLOGIES AG Inventor JAKSCHIK, Stefan
The invention relates to a method for modifying a semiconductor section by section. For doping purposes, the sections that for example are to remain undoped, are masked by a metal oxide, e.g. aluminium oxide (6). The semiconductor is subsequently doped, e.g. from a gas phase, in those sections (7) that have not been covered by the aluminium oxide. The aluminium oxide is then selectively removed, for example using hot phosphoric acid, thus leaving sections of the semiconductor surface consisting of silicon, silicon oxide or silicon nitride on the wafer.
4.WO/2003/058704METHOD FOR PRODUCING A PROTECTION FOR CHIP EDGES AND SYSTEM FOR THE PROTECTION OF CHIP EDGES
WO - 17.07.2003
Int.Class H01L 21/44
HELECTRICITY
01ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H1060
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
34the devices having semiconductor bodies not provided for in groups H01L21/18, H10D48/04 and H10D48/07158
44Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/36-H01L21/428158
 Appl.No PCT/DE2003/000012 Applicant INFINEON TECHNOLOGIES AG Inventor ZACHERL, Jürgen
The invention relates to a method for producing a protection for the chip edges of electronic components that are not provided with a housing, according to which semiconductor chips provided with a laterally open bonding channel are mounted on a substrate with a tape interposed between. The invention further relates to a system for protecting chip edges. The aim of the invention is to provide a method which is easy to carry out and to provide a system for the secure protection of chip edges/corners. This aim is achieved by using for the assembly of the semiconductor chip on the substrate a tape whose cross- section is smaller than the cross-section of the semiconductor so that between the semiconductor and the substrate, along its outer edge, a peripheral recessed section is formed as a capillary. After establishment of the electrical connections between the semiconductor and the substrate, in a first step, a flowable encapsulation material is introduced into the bonding channel by wire-bonding until the encapsulation material evenly encloses the borders of the semiconductor chip. In a second step, the bonding channel is completely filled with the encapsulation material.
5.WO/2004/042735BILAYER CMP PROCESS TO IMPROVE SURFACE ROUGHNESS OF MAGNETIC STACK IN MRAM TECHNOLOGY
WO - 21.05.2004
Int.Class G11C 11/16
GPHYSICS
11INFORMATION STORAGE
CSTATIC STORES
11Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
02using magnetic elements
16using elements in which the storage effect is based on magnetic spin effect
 Appl.No PCT/EP2003/012353 Applicant INFINEON TECHNOLOGIES AG Inventor COSTRINI, Greg
A method for manufacturing a magnetoresistive random access memory (MRAM) cell is disclosed, which alleviates the problem of Neel coupling caused by roughness in the interface between the tunnel junction layer and the magnetic layers. The method comprises depositing first (113) and second (114) barrier layers on the conductor (112), wherein the first barrier layer (113) has a polish rate different from that of the second barrier layer (114). The second barrier layer (114) is then essentially removed by chemical mechanical polishing (CMP), leaving a very smooth and uniform first barrier layer (113). When the magnetic stack (115) is then formed on the polished first barrier layer (113), interfacial roughness is not translated to the tunnel junction layer, and no corruption of magnetization is experienced.
6.WO/2004/017440REDUCTION OF THE CONTACT RESISTANCE IN ORGANIC FIELD EFFECT TRANSISTORS COMPRISING PALLADIUM CONTACTS BY THE USE OF PHOSPHINES AND PHOSPHINES CONTAINING METAL
WO - 26.02.2004
Int.Class H01L 51/30
HELECTRICITY
01ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H1060
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
05specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier
30Selection of materials
 Appl.No PCT/DE2003/002379 Applicant INFINEON TECHNOLOGIES AG Inventor KLAUK, Hagen
The invention relates to a semiconductor device comprising a semiconductor section consisting of an organic semiconductor material, a first contact for injecting charge carriers into the semiconductor section and a second contact for extracting charge carriers from the semiconductor section. A phosphine layer is located between the first contact and the semiconductor section and/or between the second contact and the semiconductor section. The phosphine acts as a charge transfer molecule, which facilitates the transfer of charge carriers between the contact and the organic semiconductor material. This enables the contact resistance between the contact and the organic material to be significantly reduced.
7.WO/2004/019405SEMICONDUCTOR COMPONENT HAVING A CHIP SCALE PACKAGE (CSP) HOUSING
WO - 04.03.2004
Int.Class H01L 23/31
HELECTRICITY
01ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H1060
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
 Appl.No PCT/EP2003/009227 Applicant INFINEON TECHNOLOGIES AG Inventor HEDLER, Harry
The invention relates to a semiconductor component (1) for mounting on a printed circuit board. The semiconductor component comprises a housing (8). This housing (8) at least partially surrounds at least one flat semiconductor chip (3). Electric contacts (5) are assigned to the semiconductor chip and serve to establish an electrical connection to electrodes or electrode surfaces provided on the printed circuit board. The flat semiconductor chip (3) has a mounting lateral surface (33). Electric contact surfaces (32) for contacting the electric contacts (5) are provided on the mounting lateral surface (33). A buffer layer (7), which is located between the housing (8) and the semiconductor chip, surrounds the semiconductor chip (3) up to a supporting surface (31) located on the mounting lateral surface (33). This supporting surface (31) is significantly smaller than the mounting lateral surface (33).
8.WO/2001/065671LINEAR MOTOR
WO - 07.09.2001
Int.Class H02K 41/03
HELECTRICITY
02GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
KDYNAMO-ELECTRIC MACHINES
41Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
02Linear motors; Sectional motors
03Synchronous motors; Motors moving step by step; Reluctance motors
 Appl.No PCT/JP2001/001533 Applicant SHINANO ELECTRONICS CO., LTD. Inventor ITOH, Masato
A two-phase flat linear motor of high speed, high thrust and high efficiency used for IC handlers or the like is disclosed. A platen (50) is a laminated body in which a plurality of magnetic thin sheets (T) are laminated in the X-axis direction. Pole teeth (KAX, KA'X, KBX, KB'X) of an X-axis mover (60X) are arranged flat in the Y-axis direction with equal spatial phases with respect to a closest dot (D) in the Y-axis direction, while they are repetitively arranged every one dot pitch in the X-axis direction. The pole teeth contained within one pitch are so staggered that the with spatial phases with respect to a closest dot (D) in the X-axis direction are mutually different by 1/4 pitch. With this staggered arrangement, the X-axis mover (60X) can move in X-axis direction. Consequently, the laminated body of the magnetic thin plates can be utilized as a platen.
9.WO/2004/052665A WHEELIE-BIN HITCH
WO - 24.06.2004
Int.Class B60D 1/00
BPERFORMING OPERATIONS; TRANSPORTING
60VEHICLES IN GENERAL
DVEHICLE CONNECTIONS
1Traction couplings; Hitches; Draw-gear; Towing devices
 Appl.No PCT/AU2003/000768 Applicant GANNAWAY, Kevin, John Inventor GANNAWAY, Kevin, John
A hitch to which a “wheelie-bin” is being secured and immobilised for transport between points of pick-up and set-down, the hitch comprising a shaft in one piece and a hook so that the lower end of the shaft is hooked below the base of the bin between the “wheelie-bin” wheels, the upper end of the shaft has a sliding clamp which fits neatly over the handle system of the bin and is adjusted by means of the sliding clamp.
10.WO/1994/025324IMAGING OFFSET SYSTEM APPLIED TO THE DRIVING OF VEHICULES AND TRAINS
WO - 10.11.1994
Int.Class B60R 1/00
BPERFORMING OPERATIONS; TRANSPORTING
60VEHICLES IN GENERAL
RVEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
1Optical viewing arrangements; Real-time viewing arrangements for drivers or passengers using optical image capturing systems, e.g. cameras or video systems specially adapted for use in or on vehicles
 Appl.No PCT/FR1994/000505 Applicant SOCIETE NATIONALE DES CHEMINS DE FER FRANÇAIS Inventor BERNARD, Patrice
The invention relates to an imaging offset system applied to the driving of vehicles and trains, characterized by an assembly of one or a plurality of cameras which may be adjustable or not, and having a variable or fixed focal length, by one or a plurality of screens which display a general view or a detailed view, with the possibility of using a tactile type general view screen, as well as optionally one or a plurality of video recorders, said assembly or only part of it being offset inside the locomotive or the train, or arranged in a detachable module.
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