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1 / 221,746
1.WO/2025/255395SYSTEMS AND METHODS FOR EX VIVO PERFUSION OF AN ORGAN
WO - 11.12.2025
Int.Class A01N 1/143
AHUMAN NECESSITIES
01AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
NPRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF ; BIOCIDES, e.g. AS DISINFECTANTS, AS PESTICIDES OR AS HERBICIDES ; PEST REPELLANTS OR ATTRACTANTS; PLANT GROWTH REGULATORS
1Preservation of bodies of humans or animals, or parts thereof
10Preservation of living parts
14Mechanical aspects of preservation; Apparatus or containers therefor
142Apparatus
143for organ perfusion
 Appl.No PCT/US2025/032534 Applicant PARAGONIX TECHNOLOGIES, INC. Inventor TAJIMA, Michael
Methods and systems for ex vivo perfusion of an organ, such as a donor heart, are disclosed. A normothermic perfusion circuit can be used to perfuse a donor heart after transportation and before transplantation. The circuit can drain the organ storage container of cold preservation solution, perfuse the aorta of the heart with warm fluid to initiate heart activity, and then perfuse the left atrium of the heart with warm fluid to bolster heart activity and evaluate heart viability. Heart viability can be determined using parameters measured by sensors in the circuit. The organ can be supported on an organ rest (236) when fluid is drained, and/or be suspended from an organ adapter (238).
2.WO/2026/015237HAT WITH DETACHABLE LINER
WO - 15.01.2026
Int.Class A42B 1/004
AHUMAN NECESSITIES
42HEADWEAR
BHATS; HEAD COVERINGS
1Hats; Caps; Hoods
004Decorative arrangements or effects
 Appl.No PCT/US2025/033022 Applicant YO LA HATS LLC Inventor CARRE, Haley
A hat includes a crown. A band is positioned on a bottom, interior edge of the crown. Female snaps are positioned on the band. A multi-layered, detachable liner including a set of male snaps, is attached to the band via a mating to the female snaps. A detachable liner comprises an organic cotton facing outward from the interior edge of the crown and disposed to contact a forehead of a user wearing the hat, a second layer of canvas support backing the first layer, and a third layer terry cloth positioned between the first layer and the second layer, disposed to absorb sweat from the forehead, through the first layer. Grommets are positioned on the crown with a hole passing through a fabric of the crown. A chain is secured to the grommets and configured to lay across the brim or bill.
3.WO/2026/015252WIND TURBINE ASSEMBLIES AND DEPLOYMENT METHODS
WO - 15.01.2026
Int.Class F03D 9/32
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
03MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
DWIND MOTORS
9Adaptations of wind motors for special use; Combinations of wind motors with apparatus driven thereby; Wind motors specially adapted for installation in particular locations
30Wind motors specially adapted for installation in particular locations
32on moving objects, e.g. vehicles
 Appl.No PCT/US2025/033864 Applicant UPRISE ENERGY, LLC Inventor KNIGHT, John, R.
Wind energy assemblies and deployment methods are provided that include a telescoping mast, an energy conversion system, and a carriage assembly. The telescoping mast has a top and a bottom, a mast roller system, and a plurality of mast sections. At least one of the mast sections is an internal mast section, and at least one of the mast sections is an external mast section. The energy conversion system is mounted to the top of the telescoping mast and includes a steering system, a wind instrument mast, a drive assembly, a rotor hub, a disc brake, and a plurality of blades extending from the rotor hub. The carriage assembly supports the telescoping mast. The mast roller system enables the at least one internal mast section to be pulled out from the at least one external mast section, thereby facilitating extension of the telescoping mast. A hydraulic ram assembly may be provided to rotate the telescoping mast to a vertical position.
4.WO/2026/015267GENERATIVE AI OUTPUT CACHING WITH INPUT GUIDANCE
WO - 15.01.2026
Int.Class G06N 3/045
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
3Computing arrangements based on biological models
02Neural networks
04Architecture, e.g. interconnection topology
045Combinations of networks
 Appl.No PCT/US2025/034449 Applicant GDM HOLDING LLC Inventor SARVANA, Obaid
Example systems and methods are provided. A method can include receiving, by a computing system comprising one or more computing devices, a first input for a generative machine-learned model. The method can include identifying, by the computing system, from a first data structure comprising data indicative of a plurality of respective second inputs, one or more second inputs based on the first input. The method can include retrieving, by the computing system from a second data structure correlating the plurality of respective second inputs to a plurality of corresponding outputs generated by the generative machine-learned model based at least in part on the respective second inputs, an output corresponding to at least one second input of the one or more second inputs. The method can include outputting, by the computing system, the output corresponding to the at least one second input.
5.WO/2026/015282PACKAGE COMPRISING INTEGRATED DEVICE AND A METALLIZATION PORTION
WO - 15.01.2026
Int.Class H01L 23/538
HELECTRICITY
01ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H1060
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another
538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
 Appl.No PCT/US2025/034943 Applicant QUALCOMM INCORPORATED Inventor STONE, William
A package comprising a metallization portion; an integrated device comprising a plurality of pillar interconnects, wherein the integrated device is coupled to the metallization portion through the plurality of pillar interconnects; and an encapsulation layer at least partially encapsulating the integrated device, wherein the encapsulation layer is coupled to the metallization portion.
6.WO/2026/015297INJECTABLE BIPHASIC FORMULATIONS
WO - 15.01.2026
Int.Class A61K 9/00
AHUMAN NECESSITIES
61MEDICAL OR VETERINARY SCIENCE; HYGIENE
KPREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
9Medicinal preparations characterised by special physical form
 Appl.No PCT/US2025/035419 Applicant HALSTEAD, Joseph Inventor HALSTEAD, Joseph
The present disclosure provides novel compositions for biologically active compounds that are administered through injection. The active compounds include, but are not limited to steroid hormones, diarylheptanoids, and flavonoids. These compositions are distinguished from the prior art through the addition of an oil to the overall composition, which results in a biphasic formulation. The oil serves to enhance the efficiency of delivery of the formulation to a human or animal subject, and reduces discomfort associated with the injection process. Optionally, one or more additional substances, each of which is soluble in oil, can be added to the oil to enable the deliverable of multiple active compounds in a single injection.
7.WO/2026/015312SEMICONDUCTOR DEVICE ASSEMBLIES WITH DISCRETE MEMORY ARRAYS AND CMOS DEVICES CONFIGURED FOR EXTERNAL CONNECTION
WO - 15.01.2026
Int.Class H01L 23/538
HELECTRICITY
01ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H1060
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another
538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
 Appl.No PCT/US2025/035810 Applicant MICRON TECHNOLOGY, INC. Inventor YIP, Aaron, S.
A semiconductor device assembly can include a first semiconductor device comprising CMOS circuitry at a first active surface and a second semiconductor device having a footprint smaller than that of the first semiconductor device and including memory array circuitry at a second active surface hybrid-bonded to the first active surface. The assembly can further include a gapfill material directly contacting the first active surface of the first semiconductor device and having an upper surface coplanar with a back surface of the second semiconductor device, and a metallization layer disposed over the second semiconductor device and the gapfill material. The metallization layer can include conductive structures operably coupled to the second semiconductor device through back-side contacts of the second semiconductor device. The assembly can further include a plurality of bond pads disposed at an upper surface of the metallization layer and coupled to the conductive structures of the metallization layer.
8.WO/2026/015327MULTIPLEXING MEMORY MODULE
WO - 15.01.2026
Int.Class G11C 7/10
GPHYSICS
11INFORMATION STORAGE
CSTATIC STORES
7Arrangements for writing information into, or reading information out from, a digital store
10Input/output data interface arrangements, e.g. I/O data control circuits, I/O data buffers
 Appl.No PCT/US2025/036041 Applicant RAMBUS INC. Inventor PALMER, Robert, E.
Memory devices on a memory module may include two (or more) interfaces that access non-overlapping sets of memory arrays (i.e., two pseudo-channels). The data bus directionality of each of the two pseudo-channels may be specified or required to always be in the same direction (i.e., both read, or both write). When the data bus directionalities are tied in this manner, the data buffer devices of the module may interleave/deinterleave (i.e., time-multiplex) data for communication with a host between the two pseudo-channel data busses. The data bus directionality of each of the two pseudo-channels may be independent of the directionality of the other pseudo-channel (i.e., either can read or write without regard to the data bus directionality of the other). When the data bus directionalities are independent in this manner, the data buffer devices may interleave/deinterleave data for communication with a host within each of the two pseudo-channel data busses.
9.WO/2026/015342ANIONIC ELECTRODEPOSITABLE COATING COMPOSITIONS THAT FORM RESIN DOMAINS UPON CURE
WO - 15.01.2026
Int.Class C09D 5/44
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
5Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
44for electrophoretic applications
 Appl.No PCT/US2025/036211 Applicant PRC-DESOTO INTERNATIONAL, INC. Inventor CAMARDA, Daniel Scott
The present disclosure is directed to an anionic electrodepositable coating composition comprising an anionic salt group-containing, film-forming polymer; a curing agent; a core-shell polymer; and a corrosion inhibitor. The present disclosure is further directed to an anionic electrodepositable coating composition comprising an anionic salt group-containing, film-forming polymer; a curing agent; a latex polymer; and a corrosion inhibitor. Coating layers deposited from the compositions have at least two resin domains having different Tg values. Also disclosed are methods for using the compositions to coat a substrate and substrates coated thereby.
10.WO/2026/015357DEMODULATION REFERENCE SIGNAL DISTINCTION TO SUPPORT DOWNLINK CHANNEL COMBINING
WO - 15.01.2026
Int.Class H04L 27/26
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
LTRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
27Modulated-carrier systems
26Systems using multi-frequency codes
 Appl.No PCT/US2025/036306 Applicant QUALCOMM INCORPORATED Inventor KIM, In-Soo
Methods, systems, and devices for wireless communications are described herein. A user equipment (UE) may utilize system information signaling to initiate and maintain synchronized communications. The UE may monitor a first physical downlink control channel (PDCCH) search space and a second PDCCH search space for downlink control information (DCI) associated with a channel-specific demodulation reference signal (DMRS) scrambling identifier. In some aspects, the channel-specific DMRS scrambling identifier may identify a remaining minimum system information (RMSI)-specific PDCCH, or other PDCCH types. The UE may receive DCI associated with the channel-specific DMRS scrambling identifier according to the monitoring, such that the DCI is received in accordance with a combination of a first DCI candidate of the first PDCCH search space and a second DCI candidate of the second PDCCH search space. The UE may then receive a physical downlink shared channel (PDSCH) transmission in accordance with scheduling included in the DCI.
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