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ALLNUM:JP2006312856

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Analysis

1 / 1
1.2008125721GAME DEVICE, OPERATION EVALUATION METHOD, AND PROGRAM
JP - 05.06.2008
Int.Class A63F 13/00
AHUMAN NECESSITIES
63SPORTS; GAMES; AMUSEMENTS
FCARD, BOARD OR ROULETTE GAMES; INDOOR GAMES USING SMALL MOVING PLAYING BODIES; VIDEO GAMES; GAMES NOT OTHERWISE PROVIDED FOR
13Video games, i.e. games using an electronically generated display having two or more dimensions
 Appl.No 2006312856 Applicant KONAMI DIGITAL ENTERTAINMENT:KK Inventor ASAMI YUICHI

PROBLEM TO BE SOLVED: To provide a game device capable of appropriately evaluating the operation of a player even when display delay is caused on a display device side.

SOLUTION: A display delay calculation part 361 calculates display delay time after video signals are supplied until the video image is displayed on a display on the basis of information obtained from a controller. An image generation part 380 generates display images including an image for guiding an object operation to a player on the basis of stipulated operation information (information generated by stipulated operation information generation part 362) for stipulating the operation contents of the controller imposed on the player. An operation information acquisition part 320 acquires the operation information of the controller operated by the player. A timing adjusting part 363 adjusts comparison timing of the stipulated operation information with the acquired operation information on the basis of the calculated display delay time. Then, an evaluation part 364 evaluates the operation of the player on the basis of the relation of the operation information and the stipulated operation information at the adjusted comparison timing.

COPYRIGHT: (C)2008,JPO&INPIT

2.2006312856FLEXIBLE JOINT BURIED IN JOINT GAP SECTION OF CONCRETE STRUCTURE
JP - 16.11.2006
Int.Class E01C 11/02
EFIXED CONSTRUCTIONS
01CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
CCONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
11Details of pavings
02Arrangement or construction of joints; Methods of making joints; Packing for joints
 Appl.No 2005166108 Applicant HIROSHIMA KASEI LTD Inventor TATSUMA AKIHIRO

PROBLEM TO BE SOLVED: To provide a flexible joint capable of being buried in a joint gap of a concrete structure such as a railway viaduct or the like and absorbing a thermal expansion difference and obtaining a cut-off effect.

SOLUTION: The flexible joint (1) formed of an EPDEM composite and buried in the joint gap (63) is molded by combining a shaft (2) fittingly inserted in a small diameter joint gap (65) with an umbrella section (2) mounted in a large diameter joint gap (66), at least one hollow section (5) is formed in of the shaft (2), cut-off lips (6 and 7) are formed around an outer circumferential wall (4), a groove (8) is formed in the longitudinal direction of a lower bottom, the umbrella section (3) is formed of an outer circumferential wall (11), at least one of hollow sections (12, 13, and 14) is formed thereon, at least one of grooves (15, 16 and 17) is formed in the longitudinal direction of an upper bottom surface, at least one of grooves (18, 19 and 20) is formed on the lower bottom surface, cut-off lips (23 and 24) are provided around the outer circumferential wall (11), and the whole is integrally molded.

COPYRIGHT: (C)2007,JPO&INPIT

3.WO/2007/010717DOUBLE SIDE POLISHING METHOD FOR WAFER
WO - 25.01.2007
Int.Class B24B 37/00
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
 Appl.No PCT/JP2006/312856 Applicant SHIN-ETSU HANDOTAI CO., LTD. Inventor UENO, Junichi
A double side polishing method for a wafer, for simultaneously polishing both sides of the wafer held by a carrier, with the wafer clamped between upper and lower surface plates to which polishing cloth is applied and with slurry supplied between the upper and lower surface plates from a plurality of slurry supply holes provided in the upper surface plate. When both sides of the wafer are polished, the amount of slurry supplied from slurry supply holes provided outside the center of rotation of the upper surface plate is set larger than the amount of slurry supplied from slurry supply holes provided inside the center. As a result, the amount of polishing of the outer circumferential portion of the wafer is regulated to suppress outer circumferential sagging of the wafer. Occurrence of outer circumferential sagging of a wafer when its both sides are polished is thus suppressed.
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