WO/2016/203659 BONDING WIRE FOR SEMICONDUCTOR DEVICE||WO||22.12.2016|
||PCT/JP2015/070861||NIPPON MICROMETAL CORPORATION||YAMADA, Takashi|
The present invention addresses the problem of achieving a balance between a proof stress ratio (=maximum proof stress divided by the 0.2% proof stress) of 1.1-1.6, and an increase in the bonding reliability of a ball bonding part under HTS of 175-200°C in a bonding wire for a semiconductor device, said bonding wire having a Cu alloy core and a Pd coating layer formed on the surface of the Cu alloy core. The bonding reliability of a ball bonding part under HTS is increased by including, in the wire, one or more of Ni, Zn, Rh, In, Ir, and Pt in a total proportion of 0.03-2 mass%. Among the crystal orientations in the lengthwise direction of the wire as found in the measurement of crystal orientations in relation to a cross-section of the core in a direction perpendicular to the wire axis of the bonding wire, the orientation proportion of crystal orientation<100>, for which the angular difference does not exceed 15 degrees relative to the lengthwise direction of the wire, is at least 50%. The proof stress ratio is kept at or below 1.6 by obtaining an average crystal grain size of 0.9-1.3 μm in a cross-section of the core in a direction perpendicular to the wire axis of the bonding wire.
WO/2016/195138 IGM SEMI-QUANTITATIVE LEPTOSPIROSIS DIAGNOSIS KIT||WO||08.12.2016|
||PCT/KR2015/005640||IMMUNEMED INC.||KIM, Yoon Won|
The present invention relates to: a leptospirosis diagnosis kit comprising a first kit and a second kit; and a diagnosis method using the same, and enables patients with leptospirosis to be distinguished and diagnosed in both epidemic regions and endemic regions.
WO/2016/189758 BONDING WIRE FOR SEMICONDUCTOR DEVICE||WO||01.12.2016|
||PCT/JP2015/076721||NIPPON MICROMETAL CORPORATION||YAMADA, Takashi|
Provided is a Cu bonding wire having a Pd coating layer on the surface thereof, the bonding wire being suitable for vehicle-mounted devices and having improved bonding reliability at ball joints in a high-temperature high-humidity environment. This bonding wire for semiconductor devices includes: a Cu alloy core material; and a Pd coating layer formed on the surface thereof. The bonding wire includes a total of from 0.1 to 100 ppm by mass of one or more types of elements among As, Te, Sn, Sb, Bi, and Se. Thus, the bonding life of ball joints in a high-temperature high-humidity environment is improved, and bonding reliability can be improved. When the Cu alloy core material further includes from 0.011 to 1.2 mass% of one or more of Ni, Zn, Rh, In, Ir, Pt, Ga, and Ge, ball joint reliability in a high-temperature environment of 170°C or higher can be improved. Further, when an alloy skin layer including Au and Pd is formed on the surface of the Pd coating layer, wedge bondability is improved.
WO/2016/181579 CLOTH FOR DISPOSABLE TEXTILE PRODUCT, AND DISPOSABLE TEXTILE PRODUCT USING SAME||WO||17.11.2016|
||PCT/JP2015/082637||YAMADA, Kikuo||YAMADA, Kikuo|
Provided is a cloth for a disposable textile product having excellent moisture evaporation and dispersion properties, heat dissipation properties, and moisture permeability. Further provided is a disposable textile product that uses the cloth, said product being superior in terms of wearing comfort and skin contact properties, and having excellent moisture evaporation and dispersion properties, heat dissipation properties, and moisture permeability. The cloth for the disposable textile product is composed of a layered sheet 30 that: comprises breathable first and second fibrous sheets 2, 3, and a textile material 4 that diffuses liquids and is disposed between the first and second fibrous sheets 2, 3; and is formed by layering elastic members 5 together with the first and second fibrous sheets 2, 3 and the fibrous material 4. The layered sheet 30 forms a composite layer 31 obtained by laminating a textile layer that is capable of breathing, and a textile layer that is capable of diffusing liquids. The layered sheet 30 has folding sections 6 comprising protrusions and recesses formed by the composite layer 31, and the layered sheet 30 is provided with elasticity.
WO/2016/182101 OPTICAL CONNECTOR||WO||17.11.2016|
||PCT/KR2015/004819||A.J.WORLD CO., LTD.||CHOI, An Joon|
The present invention provides an optical connector comprising: a body comprising a connection part including a connection groove, a cover part, which comprises an outer surface at which a protruding lock region is formed, a first insertion part formed at one end portion of the connection part, and a second insertion part formed at the other end portion of the connection part; a holder slidably fitted into the connection part and the cover part, and comprising an inner upper surface coming into contact with the outer surface of the connection part and an inner lower surface and inner side surfaces, which come into contact with the lock region of the cover part; a guide protrusion formed to protrude from the side surface of the cover part; and a guide slot formed to be recessed from the inner side surface of the holder and formed along the longitudinal direction of the holder, such that the guide protrusion is inserted thereinto and guided therein, wherein the guide slot includes an unlock region, which gradually increases, in the longitudinal direction of the holder, a vertical distance from the inner upper surface of the holder to a contact point between the guide slot and the guide protrusion with respect to the vertical direction, thereby providing an advantageous effect of minimizing the deformation of the connection part or the cover part, resulting from the pressing of the protrusion, by excluding the protrusion, which is necessary for securing a gap between the connection part and the cover part when the connection part and the cover part are unlocked, formed at the connection part or the cover part.
WO/2016/165073 INSULATED HEATING DAMAGE FIXING PIECE, PLUG AND SOCKET||WO||20.10.2016|
||PCT/CN2015/076561||WANG, Chuan sheng||WANG, Chuan sheng|
Disclosed is an insulated heating damage fixing piece (1), which is used for enabling two conductive members (2) to be in contact with each other and limited by each other, so as to form a passage, and which is damaged in the case of overheating, enabling the two conductive members (2) to expand due to an elastic force, so as to form a broken circuit. The two conductive members (2) respectively have a slot (21) recessed from an edge, and the slot (21) has a slot width (S). The insulated heating damage fixing piece (1) comprises: a connecting member (11) and two limiting members (12) combined at both ends of the connecting member (11), wherein the connecting member (11) is provided in the slot (21); the two limiting members (12) have a working width (W) greater than the slot width (S), and an accommodating space (V) is provided between the two limiting members (12) for accommodating the two conductive members (2), so that the two limiting members (12) abut against opposite outer sides of the two conductive members (2), and the two conductive members (2) are in contact with each other and limited by each other; and the connecting member is damaged in the case of overheating. The insulated heating damage fixing piece (1) can be used for the overheating protection for a plug and a socket.
WO/2016/143695 REPAIR JOINT AND METHOD FOR REPAIRING SUBAQUEOUS CABLE||WO||15.09.2016|
||PCT/JP2016/056786||SUMITOMO ELECTRIC INDUSTRIES, LTD.||TOMIOKA Satoshi|
Provided is a repair joint having a novel structure and which can be used to accomplish a fine sideways-laying submergence operation. This repair joint has: a repair joint body portion used to join end portions of subaqueous cables to each other; and a movable engagement portion provided on the outer circumference of the repair joint body portion so as to be movable in the circumferential direction relative to the repair joint body portion, and with which a sling for hanging the repair joint body portion is engaged.
WO/2016/135739 MULTI-PLANAR CAMERA APPARATUS||WO||01.09.2016|
||PCT/IN2015/000108||MIRLAY, Ram Srikanth||MIRLAY, Ram Srikanth|
The present invention provides a multi-planar camera apparatus in which movable image capturing members that are connected to lateral space variators that are arranged to move laterally, horizontally and vertically in multiple planes and to cyclorotate, while capturing 3-D spatial images of the target-subject with enhanced depth angle and displaying directly through eye piece complexes or through a display unit. The multi-planar camera apparatus of the present invention is provided with a wider field of view to capture panoramic images of target-subjects. Further, the multi-planar camera of the present invention is equipped to capture 3-D spatial images of the target-subject without tilting or turning the body of the camera apparatus. Furthermore, the multi-planar camera apparatus of the present invention obliterates 3-D triangle of invisibility that forms between the image capturing members.
WO/2016/135993 BONDING WIRE FOR SEMICONDUCTOR DEVICES||WO||01.09.2016|
||PCT/JP2015/066385||NIPPON MICROMETAL CORPORATION||ODA, Daizo|
Provided is a Cu bonding wire having a Pd coating layer on the surface, which has improved bonding reliability at a ball joint in a high-temperature high-humidity environment, and which is suitable to devices for in-vehicle use. A bonding wire for semiconductor devices, which comprises a Cu alloy core material and a Pd coating layer that is formed on the surface of the Cu alloy core material, and wherein the bonding wire contains In in an amount of 0.011-1.2% by mass and the Pd coating layer has a thickness of 0.015-0.150 μm. Consequently, the bonding life in a ball joint in a high-temperature high-humidity environment is improved, and the bonding reliability is able to be improved. If the Cu alloy core material contains one or more elements selected from among Pt, Pd, Rh and Ni respectively in an amount of 0.05-1.2% by mass, the ball joint reliability in a high temperature environment at 175°C or more is able to be improved. In addition, if an Au superficial layer is additionally formed on the surface of the Pd coating layer, wedge bondability is improved.
WO/2016/132624 BOILING WATER-TYPE GEOTHERMAL HEAT EXCHANGER AND BOILING WATER-TYPE GEOTHERMAL POWER GENERATION DEVICE||WO||25.08.2016|
This geothermal heat exchanger 1 is provided with a water injection pipe 2, which is provided underground and to which water is supplied from above the ground, and a steam extraction pipe 3, which is provided underground so as to be in contact with the water injection pipe 2. A plurality of jetting ports 5 are provided in a lower region of the steam extraction pipe 3, and the pressure inside the steam extraction pipe 3 is reduced close to the pressure required by a turbine 6. The steam extraction pipe 3 is formed such that the diameter of the steam extraction pipe 3 becomes smaller from below on a geothermal zone side to above on a ground surface G side. Heat from a geothermal zone 4 is supplied to the water that is supplied to the water injection pipe 2, said water becomes high-temperature pressurized water, which is jetted from the jetting port 5 into the steam extraction pipe 3 in a spray state and is converted into a single-phase steam flow, and power is generated by a generator 7. Furthermore, by lowering the water level of the water that is supplied to the water injection pipe 2, an air layer 19 is formed in an upper portion of the water injection pipe 2, and a resulting heat insulation portion is provided in a region that is in contact with a low-temperature ground zone 26 that is close to the ground surface.