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1. (US20170196080) Display device and method for detecting bonding condition in bonding area of display device

Office : United States of America
Application Number: 15214368 Application Date: 19.07.2016
Publication Number: 20170196080 Publication Date: 06.07.2017
Grant Number: 10321559 Grant Date: 11.06.2019
Publication Kind : B2
IPC:
H05K 1/02
H05K 1/14
H05K 3/36
H05K 1/11
H05K 1/18
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
14
Structural association of two or more printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
36
Assembling printed circuits with other printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
11
Printed elements for providing electric connections to or between printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
CPC:
H05K 1/14
H05K 1/0268
H05K 1/181
H05K 3/361
H05K 1/118
H05K 2201/10128
Applicants: BOE TECHNOLOGY GROUP CO., LTD.
Inventors: Song Meng
Danna Song
Agents: Womble Bond Dickinson (US) LLP
Priority Data: 2016 1 0006816 04.01.2016 CN
Title: (EN) Display device and method for detecting bonding condition in bonding area of display device
Abstract: front page image
(EN)

The display device comprises a printed circuit board, a display panel and a chip on film for connecting the printed circuit board with the display panel. The chip on film comprises a plurality of output pads and a plurality of first test pads which are close to the plurality of output pads and arranged at intervals. The display panel comprises a plurality of input pads in one-to-one correspondence with the plurality of output pads of the chip on film, and a plurality of second test pads which are close to the plurality of input pads of the display panel and arranged at intervals. A gap between two adjacent first test pads of the chip on film overlaps a second test pad of the display panel such that the two adjacent first test pads of the chip on film are connected via the second test pad of the display panel.