A cooling system is provided for a head mounted device for augmented reality applications. The head mounted device has a visor housing having one or more exhaust vents and one or more intake vents, a motherboard disposed within the visor housing, at least one processor mounted to the motherboard and at least one camera mounted to the motherboard. At least a pair of cooling subsystems disposed within the visor housing provide generally balanced horizontal weight to the visor housing. The cooling subsystems are arranged to receive air flow through the intake vents and transfer heat generated by the at least one processor to air exhausted from the exhaust vents.