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1. US20170184863 - COOLING SYSTEM FOR HEAD MOUNTED DEVICE

Office United States of America
Application Number 15389570
Application Date 23.12.2016
Publication Number 20170184863
Publication Date 29.06.2017
Publication Kind A1
IPC
G02B 27/01
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
27Optical systems or apparatus not provided for by any of the groups G02B1/-G02B26/119
01Head-up displays
H05K 7/20
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
G02B 27/0176
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
27Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
01Head-up displays
017Head mounted
0176characterised by mechanical features
Applicants SULON TECHNOLOGIES INC.
Inventors Dhanushan BALACHANDRESWARAN
Weizhong HU
Kibaya Mungai NJENGA
Adam Nicholas SEANGIO
Title
(EN) COOLING SYSTEM FOR HEAD MOUNTED DEVICE
Abstract
(EN)

A cooling system is provided for a head mounted device for augmented reality applications. The head mounted device has a visor housing having one or more exhaust vents and one or more intake vents, a motherboard disposed within the visor housing, at least one processor mounted to the motherboard and at least one camera mounted to the motherboard. At least a pair of cooling subsystems disposed within the visor housing provide generally balanced horizontal weight to the visor housing. The cooling subsystems are arranged to receive air flow through the intake vents and transfer heat generated by the at least one processor to air exhausted from the exhaust vents.