(EN)
The disclosure is directed at a method and apparatus for integrated real-time monitoring and control of microstructure and/or geometry in thermal material processing (TMP) technologies. The method includes obtaining real-time thermal dynamic variables, such as, but not limited to the cooling rate, peak temperature and heating rate, and geometry of the thermal material process. These real-time thermal variables are then analyzed along with a thermal model to determine a microstructure/geometry model. This microstructure/geometry model can then be used to provide the real-time monitoring and control of a finished state for the material being processed by the thermal material processing procedure.