(EN)
A semiconductor module includes a semiconductor chip, base frame, a circuit board, and a screw. The base frame has a main surface having a concave portion in which the semiconductor chip is mounted. The base frame is thermally and electrically connected with the semiconductor chip through a die bonding material. The circuit board has a grounding pattern and is arranged above the main surface of the base frame. The screw electrically connects the main surface of the base frame and the outer peripheral portion of the concave portion to the grounding pattern of the circuit board and mechanically connects the base frame to the circuit board.