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1. (US20100002465) LIGHT EMITTING DIODE DEVICE AND BACKLIGHT MODULE USING THE SAME

Office : United States of America
Application Number: 12496969 Application Date: 02.07.2009
Publication Number: 20100002465 Publication Date: 07.01.2010
Publication Kind : A1
IPC:
F21V 7/00
F21V 7/04
H01L 33/00
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
7
Reflectors for light sources
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
7
Reflectors for light sources
04
Optical design
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Applicants: ADVANCED OPTOELECTRONIC TECHNOLOGY INC.
Inventors: TSANG JIAN SHIHN
CHEN IRENE
Agents: WPAT, PC;INTELLECTUAL PROPERTY ATTORNEYS
Priority Data: 097125501 07.07.2008 TW
Title: (EN) LIGHT EMITTING DIODE DEVICE AND BACKLIGHT MODULE USING THE SAME
Abstract: front page image
(EN)

A light emitting diode (LED) device comprises a substrate, an LED chip and an encapsulation body. The LED chip is mounted on the substrate, and the encapsulation body is overlaid on the LED chip and the substrate. The encapsulation body includes a light output surface. The light output surface can uniformly diffuse emission light over a wide angle in a first direction and concentrate the emission light in a second direction perpendicular to the first direction.


Also published as:
JP2010016367