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1. (US20040211449) Cleaning apparatus and substrate processing apparatus

Office : United States of America
Application Number: 10832127 Application Date: 26.04.2004
Publication Number: 20040211449 Publication Date: 28.10.2004
Publication Kind : A1
IPC:
B08B 3/00
B08B 3/02
B08B 3/04
B08B 3/08
B08B 3/10
B08B 5/02
H01L 21/00
H01L 21/02
H01L 21/304
B PERFORMING OPERATIONS; TRANSPORTING
08
CLEANING
B
CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3
Cleaning by methods involving the use or presence of liquid or steam
B PERFORMING OPERATIONS; TRANSPORTING
08
CLEANING
B
CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3
Cleaning by methods involving the use or presence of liquid or steam
02
Cleaning by the force of jets or sprays
B PERFORMING OPERATIONS; TRANSPORTING
08
CLEANING
B
CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3
Cleaning by methods involving the use or presence of liquid or steam
04
Cleaning involving contact with liquid
B PERFORMING OPERATIONS; TRANSPORTING
08
CLEANING
B
CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3
Cleaning by methods involving the use or presence of liquid or steam
04
Cleaning involving contact with liquid
08
the liquid having chemical or dissolving effect
B PERFORMING OPERATIONS; TRANSPORTING
08
CLEANING
B
CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3
Cleaning by methods involving the use or presence of liquid or steam
04
Cleaning involving contact with liquid
10
with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity, by vibration
B PERFORMING OPERATIONS; TRANSPORTING
08
CLEANING
B
CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
5
Cleaning by methods involving the use of air flow or gas flow
02
Cleaning by the force of jets, e.g. blowing-out cavities
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants: Dainippon Screen Mfg. Co., Ltd.
Inventors: Yokomoto Ryu
Hiroe Toshio
Hasegawa Koji
Agents: OSTROLENK FABER GERB &; SOFFEN
Priority Data: 2003121398 25.04.2003 JP
Title: (EN) Cleaning apparatus and substrate processing apparatus
Abstract: front page image
(EN)

A cleaning apparatus cleaning a chuck is provided with a cleaning tank, an injection nozzle, a discharge nozzle, a liquid supply mechanism and a gas supply mechanism. The liquid supply mechanism has a supply tank, a heater and a liquid distribution mechanism so that the heater heats pure water supplied from the supply tank under the room temperature for forming warm water, reduced in electrical resistance, heated to a temperature higher than the room temperature. The liquid supply mechanism supplies the formed warm water to the cleaning tank through the liquid distribution mechanism. A vertical moving mechanism moves down a transport arm thereby dipping the chuck in the warm water and cleaning the chuck. Thus, the throughput of the cleaning apparatus cleaning the chuck is improved, the quantity of consumed gas is reduced and cleaning performance is improved.


Also published as:
JP2004321971