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1. KR1020150116187 - 신축성 열전모듈

Office Republic of Korea
Application Number 1020140041049
Application Date 07.04.2014
Publication Number 1020150116187
Publication Date 15.10.2015
Grant Number
Grant Date 23.12.2015
Publication Kind B1
IPC
H01L 35/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
CPC
H01L 35/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
28operating with Peltier or Seebeck effect only
32characterised by the structure or configuration of the cell or thermo-couple forming the device ; including details about, e.g., housing, insulation, geometry, module
H01L 35/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
H01L 35/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
12Selection of the material for the legs of the junction
14using inorganic compositions
16comprising tellurium or selenium or sulfur
H01L 35/18
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
12Selection of the material for the legs of the junction
14using inorganic compositions
18comprising arsenic or antimony or bismuth
Applicants 홍익대학교 산학협력단
Inventors 오태성
최정열
Agents 정상규
Title
(KO) 신축성 열전모듈
Abstract
(KO)
본 발명은 신축성 열전모듈에 관한 것으로서, 상부기판 및 하부기판, 상기 상부기판 및 상기 하부기판에 각각 접합된 복수의 전극, 상기 상부기판의 전극과 상기 하부기판의 전극 사이에 교번 배열하여 접합되어 있는 p형 열전소자 및 n형 열전소자, 상기 p형 열전소자와 상기 n형 열전소자가 전기적으로 직렬연결되도록 상기 상부기판의 전극들 사이를 연결하고 상기 하부기판의 전극들 사이를 연결하는 신축성 배선을 포함하여 이루어지는 것을 특징으로 한다. 또한, 본 발명의 신축성 열전모듈은, 기판의 일부에 연통되어 형성된 복수의 써멀비아전극을 구비한 상부기판 및 하부기판, 상기 상부기판의 써멀비아전극과 상기 하부기판의 써멀비아전극 사이에 교번 배열하여 접합되어 있는 p형 열전소자 및 n형 열전소자, 상기 p형 열전소자와 상기 n형 열전소자가 전기적으로 직렬연결되도록 상기 상부기판의 써멀비아전극들 사이를 연결하고 상기 하부기판의 써멀비아전극들 사이를 연결하는 신축성 배선을 포함하여 이루어질 수도 있다.