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1. JP2017183201 - DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

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Office Japan
Application Number 2016072150
Application Date 31.03.2016
Publication Number 2017183201
Publication Date 05.10.2017
Grant Number 6815090
Grant Date 24.12.2020
Publication Kind B1
IPC
H05B 33/22
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
12Light sources with substantially two-dimensional radiating surfaces
22characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
G09F 9/30
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
H01L 27/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 51/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H05B 33/10
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
H05B 33/12
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
12Light sources with substantially two-dimensional radiating surfaces
CPC
H01L 27/3246
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
3246Pixel defining structures, e.g. banks
H01L 27/3211
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3206Multi-colour light emission
3211using RGB sub-pixels
H01L 51/0005
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
0002Deposition of organic semiconductor materials on a substrate
0003using liquid deposition, e.g. spin coating
0004using printing techniques, e.g. ink-jet printing, screen printing
0005ink-jet printing
H01L 51/0012
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
0002Deposition of organic semiconductor materials on a substrate
0012special provisions for the orientation or alignment of the layer to be deposited
H01L 51/5056
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
5048Carrier transporting layer
5056Hole transporting layer
H01L 51/5072
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
5048Carrier transporting layer
5072Electron transporting layer
Applicants JOLED INC
株式会社ＪＯＬＥＤ
Inventors TAKADA MASAKAZU
高田　昌和
Agents 特許業務法人　ナカジマ知的財産綜合事務所
Title
(EN) DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
(JA) 表示パネル及びその製造方法
front page image
Abstract
(EN)

PROBLEM TO BE SOLVED: To provide a display panel in which device performance is improved.

SOLUTION: A display panel 1 includes a substrate 11, first, second and third lower electrodes 12a, 12b, 12c, first and second column banks 131, 132, first, second and third organic light-emitting layers 15B, 15B, 15G, and an upper electrode 18. When first, second and third inks for forming the first, second and third organic light-emitting layers 15B, 15B, 15G are applied, ink separability for separating these inks is lower in the first column bank 131 than in the second column bank 132, and ink separability is based on the height of the first and second column banks 131, 132, or liquid repellency for the first, second and third inks of first and second column banks 131, 132.

SELECTED DRAWING: Figure 9

COPYRIGHT: (C)2018,JPO&INPIT

(JA)

【課題】デバイス性能を向上させた表示パネルを提供する
【解決手段】表示パネル１は、基板１１と、第１、第２、第３下部電極１２ａ、１２ｂ、１２ｃと、第１、第２列バンク１３１、１３２と、第１、第２、第３有機発光層１５Ｂ、１５Ｂ、１５Ｇと、上部電極１８とを備える。第１、第２、第３有機発光層１５Ｂ、１５Ｂ、１５Ｇを形成するための第１、第２、第３インクが塗布された場合に、これらのインクを分離するインク分離能は、第２列バンク１３２よりも第１列バンク１３１の方が低く、インク分離能は、第１、第２列バンク１３１、１３２の高さ、又は、第１、第２列バンク１３１、１３２の第１、第２、第３インクに対する撥液性に基づく。
【選択図】図９
Also published as
US20170287993
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