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1. JP2012256013 - MASKLESS PROCESSING APPARATUS

Office Japan
Application Number 2011232548
Application Date 24.10.2011
Publication Number 2012256013
Publication Date 27.12.2012
Publication Kind A
IPC
G03F 7/20
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
G02B 26/02
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
26Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating or modulating
02for controlling the intensity of light
G02F 1/061
GPHYSICS
02OPTICS
FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
1Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
01for the control of the intensity, phase, polarisation or colour
061based on electro-optical organic material
H01L 21/027
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
B23K 26/06
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
CPC
G03F 7/70291
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70216Systems for imaging mask onto workpiece
70283Masks or their effects on the imaging process, e.g. Fourier masks, greyscale masks, holographic masks, phase shift masks, phasemasks, lenticular masks, multiple masks, tilted masks, tandem masks
70291Addressable masks
G03F 7/70508
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
70491Information management and control, including software
70508Data handling, in all parts of the microlithographic apparatus, e.g. addressable masks
G03F 7/70558
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
7055Exposure light control, in all parts of the microlithographic apparatus, e.g. pulse length control, light interruption
70558Dose control, i.e. achievement of a desired dose
Applicants SAMSUNG ELECTRO-MECHANICS CO LTD
サムソン エレクトロ-メカニックス カンパニーリミテッド.
Inventors NA GI-RYON
ナ・ギ リョン
Agents 加藤 公延
Priority Data 10-2011-0055281 08.06.2011 KR
Title
(EN) MASKLESS PROCESSING APPARATUS
(JA) マスクレス加工装置
Abstract
(EN)

PROBLEM TO BE SOLVED: To provide a maskless processing apparatus.

SOLUTION: A maskless processing apparatus includes: an illumination optical system providing light illuminated to a substrate; a spatial light modulator (SLM) including a plurality of light conversion devices and controlling corresponding light conversion devices to selectively reflect or transmit the light illuminated from the illumination optical system according to a processing pattern, thereby converting a light amount; a projection optical system arranged so that the plurality of light conversion devices collect light corresponding to a single pixel of the substrate and projecting high energy light provided by the plurality of corresponding light conversion devices to a corresponding pixel when the light converted from the SLM is input; and a controller controlling the SLM to receive the processing pattern and selectively convert the light illuminated from the light source through the plurality of light conversion devices according to the received processing pattern. A digital mask is used, thereby reducing a use cost of a mask, easily taking active action against a change in scale of a product to be processed, and increasing the utilization and availability of maskless processing apparatus.

COPYRIGHT: (C)2013,JPO&INPIT

(JA)

【課題】本発明は、マスクレス加工装置に関する。
【解決手段】本発明のマスクレス加工装置は、基板に照射される光を提供する照明光学系と、多数の光変換素子で構成され、前記照明光学系から照射された光を加工パターンに応じて選択的に反射または透過するように当該光変換素子を調節して光量を変換する空間光変調器と、前記多数の光変換素子が前記基板の一つのピクセルに対応して集光するように配列され、前記空間光変調器により変換された光が入射されると、当該ピクセルに前記多数の当該光変換素子によって提供された高エネルギーの光を投射する投射光学系と、前記加工パターンの入力を受け、入力された加工パターンに応じて、前記光源から照射された光を前記多数の光変換素子によって選択的に変換されるように前記空間光変調器を制御する制御部と、を含み、デジタルマスクを用いることにより、マスク使用によるコストが低減し、加工しようとする対象のスケール変形に対する能動的な対応が容易であるだけでなく、前記装置の活用度及び利用度が拡大される。
【選択図】図1