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1. JP2011110560 - LASER BEAM MACHINING APPARATUS AND LASER BEAM MACHINING METHOD

Office Japan
Application Number 2009266710
Application Date 24.11.2009
Publication Number 2011110560
Publication Date 09.06.2011
Publication Kind A
IPC
B23K 26/06
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
B23K 26/38
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
38by boring or cutting
Applicants PHOETON CORP
ワイエイシイフェトン株式会社
Inventors ANDO SATOSHI
安藤 聡
Agents 秋山 敦
城田 百合子
Title
(EN) LASER BEAM MACHINING APPARATUS AND LASER BEAM MACHINING METHOD
(JA) レーザー加工装置及びレーザー加工方法
Abstract
(EN)

PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus and a laser beam machining method which form a plurality of holes different in the width and depth to be machined on a substrate in the lump by controlling the energy density of a laser beam with which machining points are each irradiated.

SOLUTION: The laser beam machining apparatus machines a plurality of portions to be machined in the lump within the region to be machined of a workpiece W, and the laser beam machining apparatus includes: a laser device; a converging means of a laser beam emitted from the laser device; and an arranging means of the workpiece. The converging means is composed of the aggregate of different micro-lenses which correspond to a portion to be machined different at least in either of the depth to be machined and the width to be machined of the portion to be machined, and in the micro-lenses, stepped parts provided with the stair-wise steps in the thickness direction are formed symmetrically on a concentric circle and the number of the steps in the stepped parts or the height of the stepped parts is formed according to the width to be machined and the depth to be machined of the portion to be machined.

COPYRIGHT: (C)2011,JPO&INPIT

(JA)

【課題】各加工点に照射されるレーザービームのエネルギー密度を制御することにより、加工幅や深度の異なる複数の穴を、基板上に一括で形成することが可能なレーザー加工装置及びレーザー加工方法を提供する。
【解決手段】被加工物Wの被加工領域内で複数の被加工部分を一括で加工するレーザー加工装置において、レーザー装置と、レーザー装置から出射されるレーザービームの集光手段と、被加工物の配置手段と、を備えたレーザー加工装置であって、集光手段は、被加工部分の加工深度及び加工幅のうち、少なくとも何れか一方が異なる被加工部分に対応した異なるマイクロレンズの集合体からなり、マイクロレンズは、厚み方向に階段状の段差を備えた段差部が同心円上で対称に形成され、段差部の段差数、又は段差部の高さが被加工部分の加工幅及び加工深度に対応して形成されてなることを特徴とする。
【選択図】図4