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1. (JP2003269817 ) COOLING SYSTEM

Office : Japan
Application Number: 2002069129 Application Date: 13.03.2002
Publication Number: 2003269817 Publication Date: 25.09.2003
Publication Kind : A
IPC:
F25B 21/2
G06F 1/20
H01L 23/38
H01L 23/467
H01L 35/28
H01L 35/30
H01L 35/32
H02N 11/0
H05K 7/20
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
25
REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION OR SOLIDIFICATION OF GASES
B
REFRIGERATION MACHINES, PLANTS, OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
21
Machines, plant, or systems, using electric or magnetic effects
02
using Peltier effect; using Nernst-Ettinghausen effect
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
1
Details not covered by groups G06F3/-G06F13/82
16
Constructional details or arrangements
20
Cooling means
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
38
Cooling arrangements using the Peltier effect
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
46
involving the transfer of heat by flowing fluids
467
by flowing gases, e.g. air
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
28
operating with Peltier or Seebeck effect only
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
28
operating with Peltier or Seebeck effect only
30
characterised by the heat-exchanging means at the junction
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
28
operating with Peltier or Seebeck effect only
32
characterised by the structure or configuration of the cell or thermo-couple forming the device
H ELECTRICITY
02
GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
N
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
11
Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
CPC:
G06F 1/203
G06F 1/206
H01L 23/38
H01L 35/30
H01L2924/0002
Y02B 60/1275
Applicants: INTERNATL BUSINESS MACH CORP
インターナショナル・ビジネス・マシーンズ・コーポレーション|||【氏名又は名称原語表記】INTERNATIONAL BUSINESS MASCHINES CORPORATION
Inventors: MAEDA KAZUHIKO
前田 一彦
AGATA HIROAKI
縣 広明
Priority Data: 2002069129 13.03.2002 JP
Title: (EN) COOLING SYSTEM
(JA) 冷却装置
Abstract: front page image
(EN) PROBLEM TO BE SOLVED: To provide a cooling system which combines power generation using the heat of heating components, and cooling of the heating components.

SOLUTION: This cooling system is provided with: a heat receiving part for receiving heat conducted from a CPU 20 which is an external heating body; a thermoelectric conversion part provided to absorb the heat of the heat receiving part and having an operating mode including a cooling mode of inputting an electric current to cool the heat receiving part, and a power generating mode of converting the heat received from the heat receiving part, into an electric current to output it; and a selecting part for selecting the operation mode in which the thermoelectric conversion part is to be operated, on the basis of the temperature conditions of the CPU 20.

COPYRIGHT: (C)2003,JPO
(JA)


【課題】 発熱部品の熱を利用した発電及び発熱部品の
冷却を両立することができる冷却装置を提供する。


【解決手段】 外部の発熱体であるCPU20から伝導
される熱を受ける受熱部と、受熱部の熱を吸収可能に設
けられ、電流を入力して受熱部を冷却する冷却モード
と、受熱部から受ける熱を電流に変換して出力する発電
モードとを含む動作モードを有する熱電変換部と、CP
U20の温度条件に基づき、熱電変換部をいずれの動作
モードで動作させるかを選択する選択部とを備える冷却
装置を提供する。


Also published as:
US20030184941US20030183269