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1. (JP2002510432 )

Office : Japan
Application Number: 53808998T Application Date: 15.01.1998
Publication Number: 2002510432 Publication Date: 02.04.2002
Publication Kind : A
Prior PCT appl.: Application Number:WOEP9800214 ; Publication Number: Click to see the data
IPC:
H05K 13/2
H05K 3/34
H05K 13/0
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
02
Feeding of components
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
CPC:
H05K 13/0069
Applicants:
Inventors:
Priority Data: 97103632 05.03.1997 EP
EP9800214 15.01.1998 WO
Title:
Abstract: front page image
Also published as:
KR1020000075925SG67004EP0990379CN1249898CA2280778WO/1998/039958