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1. CN201182049 - 单板及具有该单板的电子设备

Office China
Application Number 200820111194.2
Application Date 23.04.2008
Publication Number 201182049
Publication Date 14.01.2009
Grant Number 201182049
Grant Date 14.01.2009
Publication Kind Y
IPC
H05K 7/20
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
H01L 23/34
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
H01L 23/40
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
40Mountings or securing means for detachable cooling or heating arrangements
Applicants 杭州华三通信技术有限公司
Inventors 叶明建
王志勇
彭维萍
Agents 隆天国际知识产权代理有限公司
Title
(ZH) 单板及具有该单板的电子设备
Abstract
(ZH)

本实用新型的单板,包括PCB托盘和PCB板,PCB板穿设在PCB托盘上设置的支撑螺柱上,所述PCB板上设置有芯片,在穿过所述PCB板的所述支撑螺柱的上方连接有框格式的散热支架,所述散热支架的框格上安装有散热器,所述散热器与其对应的芯片间设置有导热介质。本实用新型还公开了一种具有本实用新型的单板的电子设备。本实用新型的单板,其散热支架能够节约单板散热器的安装空间。