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1. CN1949486 - Semiconductor device, method for assembling semiconductor device

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Office China
Application Number 200610136115.9
Application Date 11.10.2006
Publication Number 1949486
Publication Date 18.04.2007
Grant Number 1949486
Grant Date 16.06.2010
Publication Kind B
IPC
H01L 23/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
H01L 23/40
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
40Mountings or securing means for detachable cooling or heating arrangements
H01L 23/28
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
H01L 21/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
H01L 21/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56Encapsulations, e.g. encapsulating layers, coatings
CPC
H01L 23/40
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
H01L 23/4006
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
4006with bolts or screws
H01L 2023/405
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
4006with bolts or screws
4037characterised by thermal path or place of attachment of heatsink
405heatsink to package
H01L 2023/4062
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
4006with bolts or screws
4037characterised by thermal path or place of attachment of heatsink
4062heatsink to or through board or cabinet
H01L 2023/4087
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
4006with bolts or screws
4075Mechanical elements
4087Mounting accessories, interposers, clamping or screwing parts
H01L 2224/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
Applicants Sony Comp Entertainment Inc.
索尼计算机娱乐公司
Inventors Yazawa Kazuaki
矢泽和明
Agents taofeng bei
北京市柳沈律师事务所 11105
Priority Data 2005297672 12.10.2005 JP
Title
(EN) Semiconductor device, method for assembling semiconductor device
(ZH) 半导体装置、半导体装置的制作方法
front page image
Abstract
(EN)
A semiconductor chip (36) is mounted on a package substrate (30) with its circuit side facing to a board (38) . Heat is dissipated from an upper side of the semiconductor chip (36) opposite to the circuit side. A sealing resin (32) seals around the periphery of the semiconductor chip (36) so that the upper side of the semiconductor chip (36) is exposed to atmosphere. A fixing member (34) is buried in the sealing resin (32) so that a hook (40) formed on the tip of the fixing member (34) extends above the upper side of the semiconductor chip (36) . A spreader 10 dissipates heat emitted from the semiconductor chip (36) . A guiding slot (12) is formed on the side facing to the package substrate (30) of the spreader (10). The hooks (40) of the fixing members (34) are inserted into the guiding slots (12) respectively, and then the spreader 10 is rotated by predetermined angle against the package substrate (30) . Then, the hooks (40) travel along the slots (12) . Through such process, the spreader (10) is pulled to come into contact with the upper side of the semiconductor chip (36).

(ZH)

一种半导体装置和半导体装置的制作方法。其中半导体芯片(36)将电路面向下按压在封装基板(30)上而从作为电路面相反侧的上面进行散热。密封树脂层(32)将半导体芯片(36)的上面露出来地来密封该半导体芯片(36)的周围。固定部件(34)被埋入在密封树脂层内，而在固定部件前端形成的钩部(40)则比半导体芯片的上面突出。扩展板(10)将半导体芯片散发出来的热进行散热。将固定部件的钩部(40)插入到扩展板在面向封装基板侧形成的导入槽(12)内并将扩展板相对封装基板以规定量旋转，则钩部沿导入槽被引导而将扩展板按压在半导体芯片上。
Also published as
JP2007109794
US20070080471
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