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1. CN1816905 - Feedforward, feedback wafer to wafer control method for an etch process

Office China
Application Number 200480018762.9
Application Date 24.05.2004
Publication Number 1816905
Publication Date 09.08.2006
Publication Kind A
IPC
H01L 21/66
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66Testing or measuring during manufacture or treatment
CPC
G05B 19/41875
GPHYSICS
05CONTROLLING; REGULATING
BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
19Programme-control systems
02electric
418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
41875characterised by quality surveillance of production
G05B 2219/31265
GPHYSICS
05CONTROLLING; REGULATING
BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
2219Program-control systems
30Nc systems
31From computer integrated manufacturing till monitoring
31265Control process by combining history and real time data
G05B 2219/32195
GPHYSICS
05CONTROLLING; REGULATING
BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
2219Program-control systems
30Nc systems
32Operator till task planning
32195Feedforward quality control
G05B 2219/45031
GPHYSICS
05CONTROLLING; REGULATING
BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
2219Program-control systems
30Nc systems
45Nc applications
45031Manufacturing semiconductor wafers
Y02P 90/02
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
90Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Applicants Tokyo Electron Ltd.
东京毅力科创株式会社
Inventors Funk Merritt
麦里特·法克
Agents wang yi
北京东方亿思知识产权代理有限责任公司
Priority Data 10609129 30.06.2003 US
Title
(EN) Feedforward, feedback wafer to wafer control method for an etch process
(ZH) 用于刻蚀工艺的前馈和反馈晶片到晶片控制方法
Abstract
(EN)
A method of using a run-to-run (R2R) controller to provide wafer-to-wafer (W2W) control in a semiconductor processing system is provided. The R2R controller includes a feed-forward (FF) controller, a process model controller, a feedback (FB) controller, and a process controller. The R2R controller uses feed-forward data, modeling data, feedback data, and process data to update a process recipe on a wafer-to-wafer time frame.

(ZH)

本发明提供了一种使用制程到制程(R2R)控制器来提供半导体处理系统中的晶片到晶片(W2W)控制的方法。R2R控制器包括前馈(FF)控制器、工艺模型控制器、反馈(FB)控制器以及工艺控制器。R2R控制器使用前馈数据、建模数据、反馈数据和工艺数据来更新晶片到晶片时间帧上的工艺配方。