(EN)
A method and apparatus for sputter deposition in which both a pulsed DC power supply and an RF power supply apply power to the target in the sputter deposition equipment. The pulsed DC power supply provides an on cycle where power is applied to the target, and an off cycle, in which a reverse polarity is applied to the target. The application of the reverse polarity has the effect of removing any charge that may have built up on the surface of the target. This reduces the likelihood of arcing occurring on the surface of the target, which can degrade the quality of the film being deposited on the substrate. By applying RF power simultaneously with the pulsed DC power to the target, the ionization efficiency on the target surface is increased. This results in a greater amount of material being removed from the target surface more quickly.
(ZH) 用于溅射沉积的方法和装置，其中脉冲直流电源和射频电源向溅射沉积装置供电。所述脉冲直流电源提供一个打开周期，其中电源被作用于目标上，以及一个关闭周期，其中反转极性被作用于目标上。反转极性作用的影响为去除已聚集在目标表面的任何电荷。这就减少了在目标表面产生电弧放电的可能性，电弧放电可能降低沉积在基片上的薄膜的品质。通过同时在目标上作用射频电源和脉冲直流电源，目标表面的电离效率提高了。这就使得更多的物质从目标表面以更快的速度被去除。