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1. CN107004564 - A device having two end blocks, an assembly and a sputter system comprising same, and a method of providing RF power to a target assembly using said device or assembly

Office China
Application Number 201580066682.9
Application Date 08.12.2015
Publication Number 107004564
Publication Date 01.08.2017
Grant Number 107004564
Grant Date 24.01.2020
Publication Kind B
IPC
H01J 37/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes
H01J 37/34
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes
34operating with cathodic sputtering
CPC
H01J 37/32082
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
32082Radio frequency generated discharge
H01J 37/3405
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
34operating with cathodic sputtering
3402using supplementary magnetic fields
3405Magnetron sputtering
H01J 37/3444
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
34operating with cathodic sputtering
3411Constructional aspects of the reactor
3444Associated circuits
H01J 37/347
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
34operating with cathodic sputtering
3464Operating strategies
347Thickness uniformity of coated layers or desired profile of target erosion
H01J 37/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
H01J 37/3435
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
34operating with cathodic sputtering
3411Constructional aspects of the reactor
3435Target holders (includes backing plates and endblocks)
Applicants SOLERAS ADVANCED COATINGS BVBA
梭莱先进镀膜工业有限公司
Inventors DE BOSSCHER WILMERT
W·德博斯谢尔
VAN DE PUTTE IVAN
I·范德普特
Agents 中国国际贸易促进委员会专利商标事务所 11038
Priority Data 14196851 08.12.2014 EP
Title
(EN) A device having two end blocks, an assembly and a sputter system comprising same, and a method of providing RF power to a target assembly using said device or assembly
(ZH) 具有端块的设备、组件和溅射系统以及提供RF电力的方法
Abstract
(EN)
The invention discloses a device (602) for use in a sputter system(600), comprising at least a first end block (631) and a second end block (632)positioned at opposite sides of the sputter system. The device is adapted such that a target assembly comprising at least one target tube or sputter magnetron, when mounted on the first and second end blocks (631, 632), may be powered actively with RF power at both sides of the assembly, and such that the target assembly, when mounted, is not actively powered continuously with RF power simultaneously at both extremities of a target tube or sputter magnetron. An assembly (601) comprising said device and a control unit for controlling powering of opposite sides of the target assembly by RF power such that the target assembly, when mounted, is not actively powered continuously with RF power simultaneously at both extremities of a target tube or sputter magnetron is also provided, as well as a method for applying RF power to impedance target assembly.

(ZH)
一种用在溅射系统(600)中的设备(602),至少包括定位在溅射系统的相对侧处的第一端块(631)和第二端块(632)。该设备适于使得包括至少一个靶管或溅射磁控管的靶组件在被安装在第一端块和第二端块(631、632)上时可以在组件的两侧都利用RF电力被主动供电,并且使得靶组件在被安装时不在靶管或溅射磁控管的两个末端处同时利用RF电力被持续地主动供电。还提供了包括所述设备和控制单元的组件(601),其中控制单元用于控制通过RF电力对靶组件的相对侧的供电,使得靶组件在被安装时不在靶管或溅射磁控管的两个末端处同时利用RF电力被持续地主动供电,还提供了用于将RF电力施加到阻抗靶组件的方法。