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1. (CN105632382) Display device and method for detecting binding condition of binding area

Office : China
Application Number: 201610006816.4 Application Date: 04.01.2016
Publication Number: 105632382 Publication Date: 01.06.2016
Grant Number: 105632382 Grant Date: 18.05.2018
Publication Kind : B
IPC:
G09G 3/00
G01R 31/00
G PHYSICS
09
EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
G
ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
3
Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
Applicants: 京东方科技集团股份有限公司
Inventors: 孟松
宋丹娜
Agents: 北京同达信恒知识产权代理有限公司 11291
Priority Data:
Title: (EN) Display device and method for detecting binding condition of binding area
(ZH) 显示装置及其检测绑定区域绑定情况的方法
Abstract: front page image
(EN) The invention discloses a display device and a method for detecting a binding condition of a binding area. The invention is used for detecting the binding condition of the binding area after a chip-flipped film is laminated with a display panel and determining the position where the binding is not good. The display device comprises a printed circuit board, a display panel and a chip-flipped film connected to the printed circuit board and the display panel; the chip-flipped film comprises a plurality of output pins; the display panel comprises a plurality of output leads in one-to-one correspondence with the chip-flipped film; the chip-flipped film comprises a plurality of test pins which are arranged on the circumference of the output pins and arranged at intervals in the chip-flipped film; the gap between the two neighboring test pins in the chip-flipped film is superposed with the test pin in the display panel; and the two test pins in the chip-flipped film are connected through the test pins in the display panel.
(ZH) 本发明公开了一种显示装置及其检测绑定区域绑定情况的方法,用以检测该显示装置中覆晶薄膜与显示面板压合后绑定区域的绑定情况,并确定产生绑定不良的位置。所述显示装置,包括印制电路板、显示面板和用于连接所述印制电路板和显示面板的覆晶薄膜,覆晶薄膜中包括多个输出引脚,显示面板中包括与所述覆晶薄膜一一对应的多个输出引脚,覆晶薄膜中还包括紧邻所述覆晶薄膜中的输出引脚且间隔设置的多个测试引脚,显示面板中还包括紧邻显示面板中的输出引脚且间隔设置的多个测试引脚;其中,覆晶薄膜中相邻的两个测试引脚之间的间隙与显示面板中的测试引脚相重叠,使得覆晶薄膜中相邻两个测试引脚通过所述显示面板中的测试引脚相连。