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1. CN105283956 - 具有竖直堆叠的半导体芯片的集成化多路输出电源转换器

Office
China
Application Number 201480033379.4
Application Date 11.04.2014
Publication Number 105283956
Publication Date 27.01.2016
Grant Number 105283956
Grant Date 28.12.2018
Publication Kind B
IPC
H01L 27/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
H05K 1/02
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
CPC
H01L 23/49524
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
495Lead-frames ; or other flat leads
49517Additional leads
49524the additional leads being a tape carrier or flat leads
H01L 23/49562
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
495Lead-frames ; or other flat leads
49541Geometry of the lead-frame
49562for devices being provided for in H01L29/00
H01L 23/49575
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
495Lead-frames ; or other flat leads
49575Assemblies of semiconductor devices on lead frames
H01L 23/49838
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49838Geometry or layout
H01L 24/29
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28Structure, shape, material or disposition of the layer connectors prior to the connecting process
29of an individual layer connector
H01L 24/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
Applicants 德克萨斯仪器股份有限公司
Inventors M·丹尼森
M·丹尼森
B·A·卡彭特
B·A·卡彭特
O·J·洛佩斯
O·J·洛佩斯
J·A·赫尔布斯摩
J·A·赫尔布斯摩
J·诺克尔
J·诺克尔
Agents 北京纪凯知识产权代理有限公司 11245
北京纪凯知识产权代理有限公司 11245
北京纪凯知识产权代理有限公司 11245
北京纪凯知识产权代理有限公司 11245
Priority Data 14181966 17.02.2014 US
61/810,860 11.04.2013 US
Title
(ZH) 具有竖直堆叠的半导体芯片的集成化多路输出电源转换器
Abstract
(ZH)
本发明涉及一种封装的多路输出转换器(200),其包括:具有作为接地终端的芯片焊盘(201)和包括电输入终端(203)的多条引线(202)的引线框架;复合第一FET芯片(同步芯片,220),其源极终端附连到引线框架,并且在其相对的表面上第一漏极终端(221)临近第二漏极终端(222)被设置,该漏极终端分别通过第一(241)和第二(242)金属线夹连接到第一(204)和第二(205)输出引线;第二FET芯片(控制芯片,211),其竖直地设置在第一漏极终端上并且其源极终端附连到第一线夹上;第三FET芯片(控制芯片,212),其竖直地设置在第二漏极终端上并且其源极终端附连到第二线夹上;并且第二和第三芯片的漏极终端(213,214)附连到第三金属线夹(260)上,该第三金属线夹(260)连接到输入引线(203)。