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1. WO2023272637 - PACKAGING HEAT DISSIPATING COVER, CHIP PACKAGING STRUCTURE, AND ELECTRONIC DEVICE

Publication Number WO/2023/272637
Publication Date 05.01.2023
International Application No. PCT/CN2021/103793
International Filing Date 30.06.2021
IPC
H01L 23/367 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367Cooling facilitated by shape of device
H01L 23/498 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
498Leads on insulating substrates
H01L 23/373 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373Cooling facilitated by selection of materials for the device
CPC
H01L 23/367
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
367Cooling facilitated by shape of device
H01L 23/373
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
H01L 23/498
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
Applicants
  • 华为技术有限公司 HUAWEI TECHNOLOGIES CO., LTD. [CN]/[CN]
Inventors
  • 郭茂 GUO, Mao
  • 罗多纳 LUO, Duona
  • 雷张伟 LEI, Zhangwei
  • 宋永明 SONG, Yongming
  • 吕超 LV, Chao
  • 任亦纬 REN, Yiwei
Agents
  • 北京中博世达专利商标代理有限公司 BEIJING ZBSD PATENT&TRADEMARK AGENT LTD.
Priority Data
Publication Language Chinese (zh)
Filing Language Chinese (ZH)
Designated States
Title
(EN) PACKAGING HEAT DISSIPATING COVER, CHIP PACKAGING STRUCTURE, AND ELECTRONIC DEVICE
(FR) COUVERCLE DE DISSIPATION THERMIQUE D'EMBALLAGE, STRUCTURE D'ENCAPSULATION DE PUCE ET DISPOSITIF ÉLECTRONIQUE
(ZH) 一种封装散热盖、芯片封装结构及电子设备
Abstract
(EN) Embodiments of the present application relate to the technical field of chip heat dissipation, and provide a packaging heat dissipating cover, a chip packaging structure, and an electronic device, for use in solving the problem that the heat dissipating capability of a chip is sharply reduced due to the fact that it is prone to delamination between a packaging heat dissipating cover and a heat dissipating adhesive. The packaging heat dissipating cover of the embodiments of the present application comprises a top cover, and a heat dissipating cover outer frame around the top cover; the top cover is connected to the heat dissipating cover outer frame; the top cover comprises a plurality of first heat dissipating posts and a plurality of first heat dissipating connecting lines; side surfaces of the plurality of first heat dissipating posts are attached to each other; the plurality of heat dissipating posts are fixed on the plurality of first heat dissipating connecting lines.
(FR) Selon des modes de réalisation, la présente invention a trait au domaine technique de la dissipation thermique de puce, et concerne un couvercle de dissipation thermique d'emballage, une structure d'emballage de puce, et un dispositif électronique, pour une utilisation dans la résolution du problème selon lequel la capacité de dissipation thermique d'une puce est considérablement réduite en raison du fait qu'elle est sujette à un délaminage entre un couvercle de dissipation thermique d'emballage et un adhésif de dissipation thermique. Le couvercle de dissipation thermique d'emballage selon les modes de réalisation de la présente invention comprend un couvercle supérieur, et un cadre externe de couvercle de dissipation thermique autour du couvercle supérieur ; le couvercle supérieur est relié au cadre externe de couvercle de dissipation thermique ; le couvercle supérieur comprend une pluralité de premiers montants de dissipation thermique et une pluralité de premières lignes de raccordement de dissipation thermique ; les surfaces latérales de la pluralité de premiers montants de dissipation thermique sont fixées les unes aux autres ; la pluralité de montants de dissipation thermique sont fixés sur la pluralité de premières lignes de connexion de dissipation thermique.
(ZH) 本申请实施例提供一种封装散热盖、芯片封装结构及电子设备,涉及芯片散热技术领域,用于解决封装散热盖与散热胶之间容易出现分层而导致芯片散热能力急剧下降的问题。本申请实施例的封装散热盖包括封装散热盖,所述封装散热盖包括顶盖、以及绕所述顶盖一周的散热盖外框,所述顶盖与所述散热盖外框相连接,所述顶盖包括多个第一散热柱和多条第一散热连接线,多个所述第一散热柱的侧面相互贴合,所述多个所述散热柱固定在所述多条第一散热连接线上。
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