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1. WO2022254271 - SHELL STRUCTURES FOR THERMAL INTERFACE MATERIALS

Publication Number WO/2022/254271
Publication Date 08.12.2022
International Application No. PCT/IB2022/054496
International Filing Date 13.05.2022
IPC
H01L 23/42 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
42Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
H05K 7/20 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
H01L 23/42
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
Applicants
  • 3M INNOVATIVE PROPERTIES COMPANY [US]/[US]
Inventors
  • GAIDE, Tom
  • OSTROWSKI, Karoline Anna
  • TEGEDER, Patricia
  • EICHLER, Jens
  • BRAND, Simon
Agents
  • LOWN, Jean A.,
  • BLANK, Colene H.,
  • EHRICH, Dena M.
  • GEISE, C. Michael,
  • LEVINSON, Eric D.,
  • NOWAK, Sandra K.,
Priority Data
21177477.302.06.2021EP
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) SHELL STRUCTURES FOR THERMAL INTERFACE MATERIALS
(FR) STRUCTURES D'ENVELOPPE POUR MATÉRIAUX D'INTERFACE THERMIQUE
Abstract
(EN) The present invention relates to a thermally conductive structure comprising a first and a second element, a shell structure between the first element and the second element, wherein the shell structure, the first element and the second element define an enclosed space, and a thermal interface material comprised in the enclosed space.
(FR) La présente invention concerne une structure thermoconductrice comprenant un premier et un second élément, une structure d'enveloppe entre le premier élément et le second élément, la structure d'enveloppe, le premier élément et le second élément définissant un espace fermé, et un matériau d'interface thermique compris dans l'espace fermé.
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