Processing

Please wait...

Settings

Settings

Goto Application

1. WO2022210497 - COLORED PHOTOSENSITVE RESIN COMPOSITION, CURED PRODUCT, PARTITION WALL, COLOR FILTER, AND IMAGE DISPLAY DEVICE

Publication Number WO/2022/210497
Publication Date 06.10.2022
International Application No. PCT/JP2022/014893
International Filing Date 28.03.2022
IPC
C08F 2/44 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
2Processes of polymerisation
44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
C08F 2/48 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
2Processes of polymerisation
46Polymerisation initiated by wave energy or particle radiation
48by ultra-violet or visible light
G03F 7/004 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/031 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
028with photosensitivity-increasing substances, e.g. photoinitiators
031Organic compounds not covered by group G03F7/02967
G03F 7/038 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
038Macromolecular compounds which are rendered insoluble or differentially wettable
G09F 9/30 2006.1
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
CPC
C08F 2/44
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
2Processes of polymerisation
44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
C08F 2/48
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
2Processes of polymerisation
46Polymerisation initiated by wave energy or particle radiation
48by ultra-violet or visible light
G02B 5/20
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
5Optical elements other than lenses
20Filters
G03F 7/004
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/031
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
028with photosensitivity-increasing substances, e.g. photoinitiators
031Organic compounds not covered by group G03F7/029
G03F 7/038
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
038Macromolecular compounds which are rendered insoluble or differentially wettable
Applicants
  • 三菱ケミカル株式会社 MITSUBISHI CHEMICAL CORPORATION [JP]/[JP]
Inventors
  • 利光 恵理子 TOSHIMITSU Eriko
Agents
  • 田▲崎▼ 聡 TAZAKI Akira
  • 伏見 俊介 FUSHIMI Shunsuke
  • 大浪 一徳 ONAMI Kazunori
Priority Data
2021-06105531.03.2021JP
2021-09032328.05.2021JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) COLORED PHOTOSENSITVE RESIN COMPOSITION, CURED PRODUCT, PARTITION WALL, COLOR FILTER, AND IMAGE DISPLAY DEVICE
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE COLORÉE, PRODUIT DURCI, PAROI DE SÉPARATION, FILTRE COLORÉ ET DISPOSITIF D'AFFICHAGE D'IMAGE
(JA) 着色感光性樹脂組成物、硬化物、隔壁、カラーフィルタ及び画像表示装置
Abstract
(EN) The present invention provides a colored photosensitive resin composition capable of forming a partition wall having excellent patterning properties. This colored photosensitive resin composition is characterized by containing (a) a coloring agent, (b) an alkali-soluble resin, (c) a photopolymerization initiator, (d) a photopolymerizable compound, and (e) a liquid repellent. The colored photosensitive resin composition is also characterized in that: the content ratio of the (a) coloring agent is 20% by mass or less with respect to the total solid content of the colored photosensitive resin composition; the (a) coloring agent contains (a1) titanium oxide particles; the (b) alkali-soluble resin has a double bond equivalent of 1000 g/mol or less; the (c) photopolymerization initiator contains an oxime ester-based photopolymerization initiator (c1) having a maximum absorption wavelength (λmax) between 300 nm and 350 nm wavelengths; and the (e) liquid repellent contains a compound (e1) that has a crosslinking group and has a fluorine atom and/or a siloxane chain.
(FR) La présente invention concerne une composition de résine photosensible colorée permettant de former une paroi de séparation présentant d'excellentes propriétés de formation de motifs. Cette composition de résine photosensible colorée est caractérisée en ce qu'elle contient un agent colorant (a), une résine soluble dans les alcalis (b), un amorceur de photopolymérisation (c), un composé photopolymérisable (d) et un répulsif liquide (e). La composition de résine photosensible colorée est également caractérisée en ce que : le rapport de teneur de l'agent colorant (a) est inférieur ou égal à 20 % en masse par rapport à la teneur totale en solides de la composition de résine photosensible colorée ; l'agent colorant (a) contient des particules d'oxyde de titane (a1) ; la résine soluble dans les alcalis (b) présente un équivalent de liaison double inférieur ou égal à 1 000 g/mol ; l'amorceur de photopolymérisation (c) contient un amorceur de photopolymérisation à base d'ester d'oxime (c1) présentant une longueur d'onde d'absorption maximale (λmax) comprise entre 300 nm et 350 nm ; et le répulsif liquide (e) contient un composé (e1) qui comprend un groupe de réticulation et comporte un atome de fluorine et/ou une chaîne siloxane.
(JA) パターニング性に優れた隔壁を形成可能な着色感光性樹脂組成物を提供する。本発明の着色感光性樹脂組成物は、(a)着色剤、(b)アルカリ可溶性樹脂、(c)光重合開始剤、(d)光重合性化合物及び(e)撥液剤を含有し、前記(a)着色剤の含有割合が着色感光性樹脂組成物の全固形分量に対して20質量%以下であり、前記(a)着色剤が、(a1)酸化チタン粒子を含有し、前記(b)アルカリ可溶性樹脂の二重結合当量が1000g/mol以下であり、前記(c)光重合開始剤が、波長300~350nmに極大吸収波長(λmax)を有するオキシムエステル系光重合開始剤(c1)を含有し、前記(e)撥液剤が、架橋基を有し、且つフッ素原子及び/又はシロキサン鎖を有する化合物(e1)を含有することを特徴とする。
Latest bibliographic data on file with the International Bureau