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1. WO2022209064 - ADHESIVE PASTE, METHOD FOR USING ADHESIVE PASTE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Publication Number WO/2022/209064
Publication Date 06.10.2022
International Application No. PCT/JP2021/047322
International Filing Date 21.12.2021
IPC
C09J 11/04 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
04inorganic
C09J 183/04 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
183Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
04Polysiloxanes
H01L 21/52 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52Mounting semiconductor bodies in containers
CPC
C09J 11/04
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
02Non-macromolecular additives
04inorganic
C09J 183/04
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
183Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
04Polysiloxanes
H01L 21/52
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
52Mounting semiconductor bodies in containers
Applicants
  • リンテック株式会社 LINTEC CORPORATION [JP]/[JP]
Inventors
  • 宮脇 学 MIYAWAKI Manabu
  • 三浦 迪 MIURA Susumu
Agents
  • 大石 治仁 OHISHI Haruhito
Priority Data
2021-05673630.03.2021JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) ADHESIVE PASTE, METHOD FOR USING ADHESIVE PASTE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
(FR) PÂTE ADHÉSIVE, PROCÉDÉ D'UTILISATION DE LA PÂTE ADHÉSIVE ET PROCÉDÉ DE PRODUCTION DE DISPOSITIF À SEMI-CONDUCTEUR
(JA) 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法
Abstract
(EN) The present invention provides an adhesive paste that contains a curable organopolysiloxane compound and a heat conductive filler, wherein: the thermal conductivity of a cured product which is obtained by heat curing of the adhesive paste at 120°C for 4 hours is 0.5 W/(m·K) or more; and the adhesive strength at 100°C between a silver-plated copper plate and a cured product which is obtained by heat curing of the adhesive paste at 170°C for 2 hours is 5 N/mm□ or more. The present invention provides: an adhesive paste which makes it possible to reduce or prevent thermal deterioration in optical components, sensor chips, and the like due to heat generation in a semiconductor element and a semiconductor device including the semiconductor element and to reduce or prevent detachment of a semiconductor element in a wire bonding process; a method for using the adhesive paste as an adhesive agent for a semiconductor element fixing material; and a method for producing a semiconductor device.
(FR) La présente invention concerne une pâte adhésive qui contient un composé organopolysiloxane durcissable et une charge thermoconductrice , la conductivité thermique d'un produit durci qui est obtenu par thermodurcissement de la pâte adhésive à 120 °C pendant 4 heures étant supérieure ou égale à 0,5 W/(m·K) ; et la force d'adhérence à 100 °C entre une plaque de cuivre plaquée d'argent et un produit durci qui est obtenu par thermodurcissement de la pâte adhésive à 170 °C pendant 2 heures étant supérieure ou égale à 5 N/mm2. La présente invention concerne : une pâte adhésive qui permet de réduire ou d'empêcher une dégradation thermique dans des composants optiques, des puces de capteur et similaires, en raison du dégagement de chaleur dans un élément semi-conducteur et un dispositif à semi-conducteur comprenant l'élément semi-conducteur, et de réduire ou d'empêcher un détachement d'un élément semi-conducteur dans un processus de liaison de fils ; un procédé d'utilisation de la pâte adhésive en tant qu'agent adhésif pour un matériau de fixation d'élément semi-conducteur ; et un procédé de production d'un dispositif à semi-conducteur.
(JA) 本発明は、硬化性オルガノポリシロキサン化合物、及び、熱伝導性フィラーを含有する接着ペーストであって、前記接着ペーストを120℃で4時間加熱硬化して得られる硬化物の熱伝導率が、0.5W/(m・K)以上であり、前記接着ペーストを170℃で2時間加熱硬化して得られる硬化物と、銀メッキ銅板との100℃における接着強度が、5N/mm□以上である接着ペーストである。本発明によれば、半導体素子や該半導体素子を備える半導体装置の発熱に伴う光学部品やセンサチップ等の熱劣化を低減ないし防止することができ、かつ、ワイヤーボンディング工程において、半導体素子の剥がれを低減ないし防止することができる接着ペースト、この接着ペーストを半導体素子固定材用接着剤として使用する方法及び半導体装置の製造方法が提供される。
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